Microelectronic devices with tiered decks of differing pillar density and related methods and systems

ABSTRACT

Microelectronic devices include a lower deck and an upper deck, each comprising a stack structure with a vertically alternating sequence of insulative structures and conductive structures arranged in tiers. A lower array of pillars extends through the stack structure of the lower deck, and an upper array of pillars extends through the stack structure of the upper deck. Along an interface between the lower deck and the upper deck, the pillars of the lower array align with the pillars of the upper array. At least at elevations comprising bases of the pillars, a pillar density of the pillars of the lower array differs from a pillar density of the pillars of the upper array, “pillar density” being a number of pillars per unit of horizontal area of the respective array. Related methods and electronic systems are also disclosed.

TECHNICAL FIELD

Embodiments of the disclosure relate to the field of microelectronicdevice design and fabrication. More particularly, the disclosure relatesto methods for forming microelectronic devices (e.g., memory devices,such as 3D NAND memory devices) having tiered stack structures thatinclude vertically alternating conductive structures and insulativestructures, to related systems, and to methods for forming suchstructures and devices.

BACKGROUND

Memory devices provide data storage for electronic systems. A Flashmemory device is one of various memory device types and has numeroususes in modern computers and other electrical devices. A conventionalFlash memory device may include a memory array that has a large numberof charge storage devices (e.g., memory cells, such as non-volatilememory cells) arranged in rows and columns. In a NAND architecture typeof Flash memory, memory cells arranged in a column are coupled inseries, and a first memory cell of the column is coupled to a data line(e.g., a bit line).

In a “three-dimensional NAND” memory device (which may also be referredto herein as a “3D NAND” memory device), a type of vertical memorydevice, not only are the memory cells arranged in row and column fashionin a horizontal array, but tiers of the horizontal arrays are stackedover one another (e.g., as vertical strings of memory cells) to providea “three-dimensional array” of the memory cells. The stack of tiersvertically alternate conductive materials with insulating (e.g.,dielectric) materials. The conductive materials function as controlgates for, e.g., access lines (e.g., word lines) of the memory cells.Vertical structures (e.g., pillars comprising channel structures andtunneling structures) extend along the vertical string of memory cells.A drain end of a string is adjacent one of the top and bottom of thevertical structure (e.g., pillar), while a source end of the string isadjacent the other of the top and bottom of the pillar. The drain end isoperably connected to a bit line, while the source end is operablyconnected to a source line. A 3D NAND memory device also includeselectrical connections between, e.g., access lines (e.g., word lines)and other conductive structures of the device so that the memory cellsof the vertical strings can be selected for writing, reading, anderasing operations.

Forming 3D NAND memory devices tends to present challenges. For example,differing residual stresses at various dispositions along a wafer, orrelative to a particular feature being constructed on the wafer, mayresult in some features, intended to be truly vertical, bending awayfrom true vertical, leading to misalignments, missed connections, orother fabrication problems with regard to subsequently-formed features.Such misalignments, missed connections, or the like may ultimately causedevice failure. Thus, reliably fabricating the features ofmicroelectronic devices, such as 3D NAND memory devices, presentschallenges.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A and FIG. 1B are partial, plan, schematic illustrations ofreticle patterns, and FIG. 1C is a cross-sectional, elevational,schematic illustration of an idealized microelectronic device structure,wherein pillars of an upper deck of the structure of FIG. 1C are formedusing the reticle pattern of FIG. 1A, and wherein pillars of a lowerdeck of the structure of FIG. 1C are formed using the reticle pattern ofFIG. 1B.

FIG. 2A through FIG. 2E are cross-sectional, elevational, schematicillustrations of memory cells, in accordance with embodiments of thedisclosure, the illustrated areas each corresponding to boxed areas ofany one or more of FIG. 1C, FIG. 4, FIG. 5C through FIG. 28C (withrespect to the “C” figures thereof), and FIG. 29 through FIG. 44.

FIG. 3 is a top plan, schematic illustration of a die on which have beenfabricated microelectronic device structures, in accordance withembodiments of the disclosure.

FIG. 4 is a cross-sectional, elevational, schematic illustration of amicroelectronic device structure, wherein a memory cell region withmultiple decks of pillars is adjacent a staircase region.

FIG. 5A and FIG. 5B are partial, plan, schematic illustrations ofreticle patterns, and FIG. 5C is a cross-sectional, elevational,schematic illustration of a microelectronic device structure, whereinpillars of an upper deck of the structure of FIG. 5C are formed usingthe reticle pattern of FIG. 5A, and wherein pillars of a lower deck ofthe structure of FIG. 5C are formed using the reticle pattern of FIG.5B, the microelectronic device structure exhibiting an observablemisalignment of the pillars of the upper deck to the pillars of thelower deck.

FIG. 6A and FIG. 6B are partial, plan, schematic illustrations ofreticle patterns, and FIG. 6C is a cross-sectional, elevational,schematic illustration of a microelectronic device structure, whereinthe reticle pattern of FIG. 6A is tailored according to the observedpillar misalignment of the microelectronic device structure of FIG. 5C,wherein the pillars of an upper deck of the structure of FIG. 6C areformed using the reticle pattern of FIG. 6A, and wherein pillars of alower deck of the structure of FIG. 6C are formed using the reticlepattern of FIG. 6B, the microelectronic device structure exhibitingalignment of the pillars of the upper deck to the pillars of the lowerdeck, in accordance with embodiments of the disclosure.

FIG. 7A and FIG. 7B are partial, plan, schematic illustrations ofreticle patterns, and FIG. 7C is a cross-sectional, elevational,schematic illustration of a microelectronic device structure, whereinthe reticle pattern of FIG. 7B is tailored according to the observedpillar misalignment of the microelectronic device structure of FIG. 5C,wherein the pillars of an upper deck of the structure of FIG. 7C areformed using the reticle pattern of FIG. 7A, and wherein pillars of alower deck of the structure of FIG. 7C are formed using the reticlepattern of FIG. 7B, the microelectronic device structure exhibitingalignment of the pillars of the upper deck to the pillars of the lowerdeck, in accordance with embodiments of the disclosure.

FIG. 8A and FIG. 8B are partial, plan, schematic illustrations ofreticle patterns, and FIG. 8C is a cross-sectional, elevational,schematic illustration of a microelectronic device structure, whereinpillars of an upper deck of the structure of FIG. 8C are formed usingthe reticle pattern of FIG. 8A, and wherein pillars of a lower deck ofthe structure of FIG. 8C are formed using the reticle pattern of FIG.8B, the microelectronic device structure exhibiting an observablemisalignment of the pillars of the upper deck to the pillars of thelower deck.

FIG. 9A and FIG. 9B are partial, plan, schematic illustrations ofreticle patterns, and FIG. 9C is a cross-sectional, elevational,schematic illustration of a microelectronic device structure, whereinthe reticle pattern of FIG. 9A is tailored according to the observedpillar misalignment of the microelectronic device structure of FIG. 8C,wherein the pillars of an upper deck of the structure of FIG. 9C areformed using the reticle pattern of FIG. 9A, and wherein pillars of alower deck of the structure of FIG. 9C are formed using the reticlepattern of FIG. 9B, the microelectronic device structure exhibitingalignment of the pillars of the upper deck to the pillars of the lowerdeck, in accordance with embodiments of the disclosure.

FIG. 10A and FIG. 10B are partial, plan, schematic illustrations ofreticle patterns, and FIG. 10C is a cross-sectional, elevational,schematic illustration of a microelectronic device structure, whereinthe reticle pattern of FIG. 10B is tailored according to the observedpillar misalignment of the microelectronic device structure of FIG. 8C,the pillars of an upper deck of the structure of FIG. 10C are formedusing the reticle pattern of FIG. 10A, and wherein pillars of a lowerdeck of the structure of FIG. 10C are formed using the reticle patternof FIG. 10B, the microelectronic device structure exhibiting alignmentof the pillars of the upper deck to the pillars of the lower deck, inaccordance with embodiments of the disclosure.

FIG. 11A and FIG. 11B are partial, plan, schematic illustrations ofreticle patterns, and FIG. 11C is a cross-sectional, elevational,schematic illustration of a microelectronic device structure, whereinpillars of an upper deck of the structure of FIG. 11C are formed usingthe reticle pattern of FIG. 11A, and wherein pillars of a lower deck ofthe structure of FIG. 11C are formed using the reticle pattern of FIG.11B, the microelectronic device structure exhibiting an observablemisalignment of the pillars of the upper deck to the pillars of thelower deck.

FIG. 12A and FIG. 12B are partial, plan, schematic illustrations ofreticle patterns, and FIG. 12C is a cross-sectional, elevational,schematic illustration of a microelectronic device structure, whereinthe reticle pattern of FIG. 12A is tailored according to the observedpillar misalignment of the microelectronic device structure of FIG. 11C,wherein the pillars of an upper deck of the structure of FIG. 12C areformed using the reticle pattern of FIG. 12A, and wherein pillars of alower deck of the structure of FIG. 12C are formed using the reticlepattern of FIG. 12B, the microelectronic device structure exhibitingalignment of the pillars of the upper deck to the pillars of the lowerdeck, in accordance with embodiments of the disclosure.

FIG. 13A and FIG. 13B are partial, plan, schematic illustrations ofreticle patterns, and FIG. 13C is a cross-sectional, elevational,schematic illustration of a microelectronic device structure, whereinthe reticle pattern of FIG. 13B is tailored according to the observedpillar misalignment of the microelectronic device structure of FIG. 11C,the pillars of an upper deck of the structure of FIG. 13C are formedusing the reticle pattern of FIG. 13A, and wherein pillars of a lowerdeck of the structure of FIG. 13C are formed using the reticle patternof FIG. 13B, the microelectronic device structure exhibiting alignmentof the pillars of the upper deck to the pillars of the lower deck, inaccordance with embodiments of the disclosure.

FIG. 14A and FIG. 14B are partial, plan, schematic illustrations ofreticle patterns, and FIG. 14C is a cross-sectional, elevational,schematic illustration of a microelectronic device structure, whereinpillars of an upper deck of the structure of FIG. 14C are formed usingthe reticle pattern of FIG. 14A, and wherein pillars of a lower deck ofthe structure of FIG. 14C are formed using the reticle pattern of FIG.14B, the microelectronic device structure exhibiting an observablemisalignment of the pillars of the upper deck to the pillars of thelower deck.

FIG. 15A and FIG. 15B are partial, plan, schematic illustrations ofreticle patterns, and FIG. 15C is a cross-sectional, elevational,schematic illustration of a microelectronic device structure, whereinthe reticle pattern of FIG. 15A is tailored according to the observedpillar misalignment of the microelectronic device structure of FIG. 14C,wherein the pillars of an upper deck of the structure of FIG. 15C areformed using the reticle pattern of FIG. 15A, and wherein pillars of alower deck of the structure of FIG. 15C are formed using the reticlepattern of FIG. 15B, the microelectronic device structure exhibitingalignment of the pillars of the upper deck to the pillars of the lowerdeck, in accordance with embodiments of the disclosure.

FIG. 16A and FIG. 16B are partial, plan, schematic illustrations ofreticle patterns, and FIG. 16C is a cross-sectional, elevational,schematic illustration of a microelectronic device structure, whereinthe reticle pattern of FIG. 16B is tailored according to the observedpillar misalignment of the microelectronic device structure of FIG. 14C,the pillars of an upper deck of the structure of FIG. 16C are formedusing the reticle pattern of FIG. 16A, and wherein pillars of a lowerdeck of the structure of FIG. 16C are formed using the reticle patternof FIG. 16B, the microelectronic device structure exhibiting alignmentof the pillars of the upper deck to the pillars of the lower deck, inaccordance with embodiments of the disclosure.

FIG. 17A and FIG. 17B are partial, plan, schematic illustrations ofreticle patterns, and FIG. 17C is a cross-sectional, elevational,schematic illustration of a microelectronic device structure, whereinpillars of an upper deck of the structure of FIG. 17C are formed usingthe reticle pattern of FIG. 17A, and wherein pillars of a lower deck ofthe structure of FIG. 17C are formed using the reticle pattern of FIG.17B, the microelectronic device structure exhibiting an observablemisalignment of the pillars of the upper deck to the pillars of thelower deck.

FIG. 18A and FIG. 18B are partial, plan, schematic illustrations ofreticle patterns, and FIG. 18C is a cross-sectional, elevational,schematic illustration of a microelectronic device structure, whereinthe reticle pattern of FIG. 18A is tailored according to the observedpillar misalignment of the microelectronic device structure of FIG. 17C,wherein the pillars of an upper deck of the structure of FIG. 18C areformed using the reticle pattern of FIG. 18A, and wherein pillars of alower deck of the structure of FIG. 18C are formed using the reticlepattern of FIG. 18B, the microelectronic device structure exhibitingalignment of the pillars of the upper deck to the pillars of the lowerdeck, in accordance with embodiments of the disclosure.

FIG. 19A and FIG. 19B are partial, plan, schematic illustrations ofreticle patterns, and FIG. 19C is a cross-sectional, elevational,schematic illustration of a microelectronic device structure, whereinthe reticle pattern of FIG. 19B is tailored according to the observedpillar misalignment of the microelectronic device structure of FIG. 17C,the pillars of an upper deck of the structure of FIG. 19C are formedusing the reticle pattern of FIG. 19A, and wherein pillars of a lowerdeck of the structure of FIG. 19C are formed using the reticle patternof FIG. 19B, the microelectronic device structure exhibiting alignmentof the pillars of the upper deck to the pillars of the lower deck, inaccordance with embodiments of the disclosure.

FIG. 20A and FIG. 20B are partial, plan, schematic illustrations ofreticle patterns, and FIG. 20C is a cross-sectional, elevational,schematic illustration of a microelectronic device structure, whereinpillars of an upper deck of the structure of FIG. 20C are formed usingthe reticle pattern of FIG. 20A, and wherein pillars of a lower deck ofthe structure of FIG. 20C are formed using the reticle pattern of FIG.20B, the microelectronic device structure exhibiting an observablemisalignment of the pillars of the upper deck to the pillars of thelower deck.

FIG. 21A and FIG. 21B are partial, plan, schematic illustrations ofreticle patterns, and FIG. 21C is a cross-sectional, elevational,schematic illustration of a microelectronic device structure, whereinthe reticle pattern of FIG. 21A is tailored according to the observedpillar misalignment of the microelectronic device structure of FIG. 20C,wherein the pillars of an upper deck of the structure of FIG. 21C areformed using the reticle pattern of FIG. 21A, and wherein pillars of alower deck of the structure of FIG. 21C are formed using the reticlepattern of FIG. 21B, the microelectronic device structure exhibitingalignment of the pillars of the upper deck to the pillars of the lowerdeck, in accordance with embodiments of the disclosure.

FIG. 22A and FIG. 22B are partial, plan, schematic illustrations ofreticle patterns, and FIG. 22C is a cross-sectional, elevational,schematic illustration of a microelectronic device structure, whereinthe reticle pattern of FIG. 22B is tailored according to the observedpillar misalignment of the microelectronic device structure of FIG. 20C,the pillars of an upper deck of the structure of FIG. 22C are formedusing the reticle pattern of FIG. 22A, and wherein pillars of a lowerdeck of the structure of FIG. 22C are formed using the reticle patternof FIG. 22B, the microelectronic device structure exhibiting alignmentof the pillars of the upper deck to the pillars of the lower deck, inaccordance with embodiments of the disclosure.

FIG. 23A and FIG. 23B are partial, plan, schematic illustrations ofreticle patterns, and FIG. 23C is a cross-sectional, elevational,schematic illustration of a microelectronic device structure, whereinpillars of an upper deck of the structure of FIG. 23C are formed usingthe reticle pattern of FIG. 23A, and wherein pillars of a lower deck ofthe structure of FIG. 23C are formed using the reticle pattern of FIG.23B, the microelectronic device structure exhibiting an observablemisalignment of the pillars of the upper deck to the pillars of thelower deck.

FIG. 24A and FIG. 24B are partial, plan, schematic illustrations ofreticle patterns, and FIG. 24C is a cross-sectional, elevational,schematic illustration of a microelectronic device structure, whereinthe reticle pattern of FIG. 24A is tailored according to the observedpillar misalignment of the microelectronic device structure of FIG. 23C,wherein the pillars of an upper deck of the structure of FIG. 24C areformed using the reticle pattern of FIG. 24A, and wherein pillars of alower deck of the structure of FIG. 24C are formed using the reticlepattern of FIG. 24B, the microelectronic device structure exhibitingalignment of the pillars of the upper deck to the pillars of the lowerdeck, in accordance with embodiments of the disclosure.

FIG. 25A and FIG. 25B are partial, plan, schematic illustrations ofreticle patterns, and FIG. 25C is a cross-sectional, elevational,schematic illustration of a microelectronic device structure, whereinthe reticle pattern of FIG. 25B is tailored according to the observedpillar misalignment of the microelectronic device structure of FIG. 23C,the pillars of an upper deck of the structure of FIG. 25C are formedusing the reticle pattern of FIG. 25A, and wherein pillars of a lowerdeck of the structure of FIG. 25C are formed using the reticle patternof FIG. 25B, the microelectronic device structure exhibiting alignmentof the pillars of the upper deck to the pillars of the lower deck, inaccordance with embodiments of the disclosure.

FIG. 26A and FIG. 26B are partial, plan, schematic illustrations ofreticle patterns, and FIG. 26C is a cross-sectional, elevational,schematic illustration of a microelectronic device structure, whereinpillars of an upper deck of the structure of FIG. 26C are formed usingthe reticle pattern of FIG. 26A, and wherein pillars of a lower deck ofthe structure of FIG. 26C are formed using the reticle pattern of FIG.26B, the microelectronic device structure exhibiting an observablemisalignment of the pillars of the upper deck to the pillars of thelower deck.

FIG. 27A and FIG. 27B are partial, plan, schematic illustrations ofreticle patterns, and FIG. 27C is a cross-sectional, elevational,schematic illustration of a microelectronic device structure, whereinthe reticle pattern of FIG. 27A is tailored according to the observedpillar misalignment of the microelectronic device structure of FIG. 26C,wherein the pillars of an upper deck of the structure of FIG. 27C areformed using the reticle pattern of FIG. 27A, and wherein pillars of alower deck of the structure of FIG. 27C are formed using the reticlepattern of FIG. 27B, the microelectronic device structure exhibitingalignment of the pillars of the upper deck to the pillars of the lowerdeck, in accordance with embodiments of the disclosure.

FIG. 28A and FIG. 28B are partial, plan, schematic illustrations ofreticle patterns, and FIG. 28C is a cross-sectional, elevational,schematic illustration of a microelectronic device structure, whereinthe reticle pattern of FIG. 28B is tailored according to the observedpillar misalignment of the microelectronic device structure of FIG. 26C,the pillars of an upper deck of the structure of FIG. 28C are formedusing the reticle pattern of FIG. 28A, and wherein pillars of a lowerdeck of the structure of FIG. 28C are formed using the reticle patternof FIG. 28B, the microelectronic device structure exhibiting alignmentof the pillars of the upper deck to the pillars of the lower deck, inaccordance with embodiments of the disclosure.

FIG. 29 is a cross-sectional, elevational, schematic illustration of amicroelectronic device structure, including an array of bit contactsformed in a pattern tailored for alignment to upper surfaces of thepillars of the upper deck of the microelectronic device structure ofFIG. 6C, in accordance with embodiments of the disclosure.

FIG. 30 is a cross-sectional, elevational, schematic illustration of amicroelectronic device structure, including an array of bit contactsformed in a pattern tailored for alignment to upper surfaces of thepillars of the upper deck of the microelectronic device structure ofFIG. 7C, in accordance with embodiments of the disclosure.

FIG. 31 is a cross-sectional, elevational, schematic illustration of amicroelectronic device structure, including an array of bit contactsformed in a pattern tailored for alignment to upper surfaces of thepillars of the upper deck of the microelectronic device structure ofFIG. 9C, in accordance with embodiments of the disclosure.

FIG. 32 is a cross-sectional, elevational, schematic illustration of amicroelectronic device structure, including an array of bit contactsformed in a pattern tailored for alignment to upper surfaces of thepillars of the upper deck of the microelectronic device structure ofFIG. 10C, in accordance with embodiments of the disclosure.

FIG. 33 is a cross-sectional, elevational, schematic illustration of amicroelectronic device structure, including an array of bit contactsformed in a pattern tailored for alignment to upper surfaces of thepillars of the upper deck of the microelectronic device structure ofFIG. 12C, in accordance with embodiments of the disclosure.

FIG. 34 is a cross-sectional, elevational, schematic illustration of amicroelectronic device structure, including an array of bit contactsformed in a pattern tailored for alignment to upper surfaces of thepillars of the upper deck of the microelectronic device structure ofFIG. 13C, in accordance with embodiments of the disclosure.

FIG. 35 is a cross-sectional, elevational, schematic illustration of amicroelectronic device structure, including an array of bit contactsformed in a pattern tailored for alignment to upper surfaces of thepillars of the upper deck of the microelectronic device structure ofFIG. 15C, in accordance with embodiments of the disclosure.

FIG. 36 is a cross-sectional, elevational, schematic illustration of amicroelectronic device structure, including an array of bit contactsformed in a pattern tailored for alignment to upper surfaces of thepillars of the upper deck of the microelectronic device structure ofFIG. 16C, in accordance with embodiments of the disclosure.

FIG. 37 is a cross-sectional, elevational, schematic illustration of amicroelectronic device structure, including an array of bit contactsformed in a pattern tailored for alignment to upper surfaces of thepillars of the upper deck of the microelectronic device structure ofFIG. 18C, in accordance with embodiments of the disclosure.

FIG. 38 is a cross-sectional, elevational, schematic illustration of amicroelectronic device structure, including an array of bit contactsformed in a pattern tailored for alignment to upper surfaces of thepillars of the upper deck of the microelectronic device structure ofFIG. 19C, in accordance with embodiments of the disclosure.

FIG. 39 is a cross-sectional, elevational, schematic illustration of amicroelectronic device structure, including an array of bit contactsformed in a pattern tailored for alignment to upper surfaces of thepillars of the upper deck of the microelectronic device structure ofFIG. 21C, in accordance with embodiments of the disclosure.

FIG. 40 is a cross-sectional, elevational, schematic illustration of amicroelectronic device structure, including an array of bit contactsformed in a pattern tailored for alignment to upper surfaces of thepillars of the upper deck of the microelectronic device structure ofFIG. 22C, in accordance with embodiments of the disclosure.

FIG. 41 is a cross-sectional, elevational, schematic illustration of amicroelectronic device structure, including an array of bit contactsformed in a pattern tailored for alignment to upper surfaces of thepillars of the upper deck of the microelectronic device structure ofFIG. 24C, in accordance with embodiments of the disclosure.

FIG. 42 is a cross-sectional, elevational, schematic illustration of amicroelectronic device structure, including an array of bit contactsformed in a pattern tailored for alignment to upper surfaces of thepillars of the upper deck of the microelectronic device structure ofFIG. 25C, in accordance with embodiments of the disclosure.

FIG. 43 is a cross-sectional, elevational, schematic illustration of amicroelectronic device structure, including an array of bit contactsformed in a pattern tailored for alignment to upper surfaces of thepillars of the upper deck of the microelectronic device structure ofFIG. 27C, in accordance with embodiments of the disclosure.

FIG. 44 is a cross-sectional, elevational, schematic illustration of amicroelectronic device structure, including an array of bit contactsformed in a pattern tailored for alignment to upper surfaces of thepillars of the upper deck of the microelectronic device structure ofFIG. 28C, in accordance with embodiments of the disclosure.

FIG. 45 is a partial, cutaway, perspective, schematic illustration of amicroelectronic device, in accordance with embodiments of thedisclosure.

FIG. 46 is a block diagram of an electronic system, in accordance withembodiments of the disclosure.

FIG. 47 is a block diagram of a processor-based system, in accordancewith embodiments of the disclosure.

DETAILED DESCRIPTION

Structures (e.g., microelectronic device structures), apparatus (e.g.,microelectronic devices), and systems (e.g., electronic systems), inaccordance with embodiments of the disclosure, include multiple decks ofpillars that extend through a respective stack of vertically alternatingconductive structures and insulative structures arranged in tiers. Alongan interface between an upper deck and a lower deck, the pillars of thelower deck align with respective, vertically adjacent pillars of theupper deck. This alignment is achieved despite the pillars of, e.g., thelower deck exhibiting some bending, even bending that is not consistentacross the array of pillars in the lower deck. To enable the alignmentof vertically adjacent pillars, the reticle used for forming the pillarsof one or more of the decks is tailored according to observedmisalignment, or observed pillar bending, from one or moreprior-fabricated structures. The tailored reticle—to be used to form thepillars of at least one of the decks—includes a pattern that defines adifferent “pillar density” (i.e., a different number of pillars, perunit of horizontal area of the respective structure or portion of thestructure (e.g., array)) than the pillar density defined by anotherreticle to be used to form a vertically adjacent deck. The differingpillar densities enable the pillars of the vertically-adjacent decks tobe formed in alignment with one another, even if the pillars of one ormore of the decks exhibit bending or other structural variation from aconsistent, true vertical orientation.

As used herein, the term “density” when referring to a particular typeof feature, means and includes the number of such features per unit ofhorizontal area of the structure that includes such features. Forexample, the term “pillar density” means and includes the number ofpillars per unit of horizontal area of the structure (e.g.,microelectronic device structure) that includes such pillars. As anotherexample, the term “pattern feature density” means and includes thenumber of pattern features per unit of horizontal area of the structure(e.g., reticle) that includes such pattern features.

As described herein, the “spacing” and “density” of a structure feature(e.g., a pattern feature, a pillar, a conductive structure) relative toanother such structure is with respect to at least lower elevations ofsuch structures. For example, the pillars of an array (e.g., series) maybe described as being “spaced” substantially evenly and/or having asubstantially consistent pillar density if at least the base of each ofthe pillars is approximately an equal distance from its respectiveneighbor(s) as the other pillars of the array, even if bending of one ormore of the pillars causes such one or more pillars to bend nearer to orfurther from its neighbors in upper elevations of the pillars.

As used herein, the term “opening” means a volume extending through atleast one structure or at least one material, leaving a gap in that atleast one structure or at least one material, or a volume extendingbetween structures or materials, leaving a gap between the structures ormaterials. Unless otherwise described, an “opening” is not necessarilyempty of material. That is, an “opening” is not necessarily void space.An “opening” formed in or between structures or materials may comprisestructure(s) or material(s) other than that in or between which theopening is formed. And, structure(s) or material(s) “exposed” within anopening is (are) not necessarily in contact with an atmosphere ornon-solid environment. Structure(s) or material(s) “exposed” within anopening may be adjacent or in contact with other structure(s) ormaterial(s) that is (are) disposed within the opening.

As used herein, the term “substrate” means and includes a base materialor other construction upon which components, such as those within memorycells, are formed. The substrate may be a semiconductor substrate, abase semiconductor material on a supporting structure, a metalelectrode, or a semiconductor substrate having one or more materials,structures, or regions formed thereon. The substrate may be aconventional silicon substrate or other bulk substrate including asemiconductive material. As used herein, the term “bulk substrate” meansand includes not only silicon wafers, but also silicon-on-insulator(“SOT”) substrates, such as silicon-on-sapphire (“SOS”) substrates orsilicon-on-glass (“SOG”) substrates, epitaxial layers of silicon on abase semiconductor foundation, or other semiconductor or optoelectronicmaterials, such as silicon-germanium (Si_(1−x)Ge_(x), where x is, forexample, a mole fraction between 0.2 and 0.8), germanium (Ge), galliumarsenide (GaAs), gallium nitride (GaN), or indium phosphide (InP), amongothers. Furthermore, when reference is made to a “substrate” in thefollowing description, previous process stages may have been utilized toform materials, structures, or junctions in the base semiconductorstructure or foundation.

As used herein, the term “insulative,” when used in reference to amaterial or structure, means and includes a material or structure thatis electrically insulating. An “insulative” material or structure may beformed of and include one or more of at least one dielectric oxidematerial (e.g., one or more of a silicon oxide (SiO_(x)),phosphosilicate glass, borosilicate glass, borophosphosilicate glass,fluorosilicate glass, an aluminum oxide (AlO_(x)), a hafnium oxide(HfO_(x)), a niobium oxide (NbO_(x)), a titanium oxide (TiO_(x)), azirconium oxide (ZrO_(x)), a tantalum oxide (TaO_(x)), and a magnesiumoxide (MgO_(x))), at least one dielectric nitride material (e.g., asilicon nitride (SiN_(y))), at least one dielectric oxynitride material(e.g., a silicon oxynitride (SiO_(x)N_(y))), at least one dielectriccarboxynitride material (e.g., a silicon carboxynitride(SiO_(x)C_(z)N_(y))), and/or air. Formulae including one or more of “x,”“y,” and/or “z” herein (e.g., SiO_(x), AlO_(x), HfO_(x), NbO_(x),TiO_(x), SiN_(y), SiO_(x)N_(y), SiO_(x)C_(z)N_(y)) represent a materialthat contains an average ratio of “x” atoms of one element, “y” atoms ofanother element, and/or “z” atoms of an additional element (if any),respectively, for every one atom of another element (e.g., Si, Al, Hf,Nb, Ti). As the formulae are representative of relative atomic ratiosand not strict chemical structure, an insulative material or insulativestructure may comprise one or more stoichiometric compounds and/or oneor more non-stoichiometric compounds, and values of “x,” “y,” and “z”(if any) may be integers or may be non-integers. As used herein, theterm “non-stoichiometric compound” means and includes a chemicalcompound with an elemental composition that cannot be represented by aratio of well-defined natural numbers and is in violation of the law ofdefinite proportions. In addition, an “insulative structure” means andincludes a structure formed of and including insulative material.

As used herein, the term “sacrificial,” when used in reference to amaterial or structure, means and includes a material or structure thatis formed during a fabrication process but which is removed (e.g.,substantially removed) prior to completion of the fabrication process.

As used herein, the terms “horizontal” or “lateral” mean and include adirection that is parallel to a primary surface of the substrate onwhich the referenced material or structure is located. The width andlength of a respective material or structure may be defined asdimensions in a horizontal plane. With reference to the figures, the“horizontal” direction may be perpendicular to an indicated “Z” axis,may be parallel to an indicated “X” axis, and may be parallel to anindicated “Y” axis.

As used herein, the terms “vertical” or “longitudinal” mean and includea direction that is perpendicular to a primary surface of the substrateon which a referenced material or structure is located. The height of arespective material or structure may be defined as a dimension in avertical plane. With reference to the figures, the “vertical” directionmay be parallel to an indicated “Z” axis, may be perpendicular to anindicated “X” axis, and may be perpendicular to an indicated “Y” axis.

As used herein, the term “width” means and includes a dimension, along ahorizontal plane (e.g., at a certain elevation, if identified), defininga maximum distance, along such plane, of the material or structure inquestion. For example, a “width” of a structure, that is at leastpartially hollow, is the horizontal dimension between outermost edges orsidewalls of the structure, such as an outer diameter for a hollow,cylindrical structure.

As used herein, the terms “thickness” or “thinness” mean and include adimension in a straight-line direction that is normal to the closestsurface of an immediately adjacent material or structure that is of adifferent composition or that is otherwise distinguishable from thematerial or structure whose thickness, thinness, or height is discussed.

As used herein, the term “between” is a spatially relative term used todescribe the relative disposition of one material, structure, orsub-structure relative to at least two other materials, structures, orsub-structures. The term “between” may encompass both a disposition ofone material, structure, or sub-structure directly adjacent the othermaterials, structures, or sub-structures and a disposition of onematerial, structure, or sub-structure indirectly adjacent to the othermaterials, structures, or sub-structures.

As used herein, the term “proximate” is a spatially relative term usedto describe disposition of one material, structure, or sub-structurenear to another material, structure, or sub-structure. The term“proximate” includes dispositions of indirectly adjacent to, directlyadjacent to, and internal to.

As used herein, the term “neighboring,” when referring to a material orstructure, means and refers to a next, most proximate material orstructure of an identified composition or characteristic. Materials orstructures of other compositions or characteristics than the identifiedcomposition or characteristic may be disposed between one material orstructure and its “neighboring” material or structure of the identifiedcomposition or characteristic. For example, a structure of material X“neighboring” a structure of material Y is the first material Xstructure, e.g., of multiple material X structures, that is next mostproximate to the particular structure of material Y. The “neighboring”material or structure may be directly or indirectly proximate thestructure or material of the identified composition or characteristic.

As used herein, the term “consistent”—when referring to a parameter,property, or condition of one structure, material, feature, or portionthereof in comparison to the parameter, property, or condition ofanother such structure, material, feature, or portion of such sameaforementioned structure, material, or feature—means and includes theparameter, property, or condition of the two such structures, materials,features, or portions being equal, substantially equal, or about equal,at least in terms of respective dispositions of such structures,materials, features, or portions. For example, two structures having“consistent” thickness as one another may each define a same,substantially same, or about the same thickness at X vertical distancefrom a feature, despite the two structures being at different elevationsalong the feature. As another example, one structuring having a“consistent” width may have two portions that each define a same,substantially same, or about the same width at elevation Y1 of suchstructure as at elevation Y2 of such structure.

As used herein, the terms “about” and “approximately,” when either isused in reference to a numerical value for a particular parameter, areinclusive of the numerical value and a degree of variance from thenumerical value that one of ordinary skill in the art would understandis within acceptable tolerances for the particular parameter. Forexample, “about” or “approximately,” in reference to a numerical value,may include additional numerical values within a range of from 90.0percent to 110.0 percent of the numerical value, such as within a rangeof from 95.0 percent to 105.0 percent of the numerical value, within arange of from 97.5 percent to 102.5 percent of the numerical value,within a range of from 99.0 percent to 101.0 percent of the numericalvalue, within a range of from 99.5 percent to 100.5 percent of thenumerical value, or within a range of from 99.9 percent to 100.1 percentof the numerical value.

As used herein, the term “substantially,” when referring to a parameter,property, or condition, means and includes the parameter, property, orcondition being equal to or within a degree of variance from a givenvalue such that one of ordinary skill in the art would understand suchgiven value to be acceptably met, such as within acceptablemanufacturing tolerances. By way of example, depending on the particularparameter, property, or condition that is substantially met, theparameter, property, or condition may be “substantially” a given valuewhen the value is at least 90.0% met, at least 95.0% met, at least 99.0%met, or even at least 99.9% met.

As used herein, reference to an element as being “on” or “over” anotherelement means and includes the element being directly on top of,adjacent to (e.g., laterally adjacent to, vertically adjacent to),underneath, or in direct contact with the other element. It alsoincludes the element being indirectly on top of, adjacent to (e.g.,laterally adjacent to, vertically adjacent to), underneath, or near theother element, with other elements present therebetween. In contrast,when an element is referred to as being “directly on” or “directlyadjacent to” another element, there are no intervening elements present.

As used herein, other spatially relative terms, such as “below,”“lower,” “bottom,” “above,” “upper,” “top,” and the like, may be usedfor ease of description to describe one element's or feature'srelationship to another element(s) or feature(s) as illustrated in thefigures. Unless otherwise specified, the spatially relative terms areintended to encompass different orientations of the materials inaddition to the orientation as depicted in the figures. For example, ifmaterials in the figures are inverted, elements described as “below” or“under” or “on bottom of” other elements or features would then beoriented “above” or “on top of” the other elements or features. Thus,the term “below” may encompass both an orientation of above and below,depending on the context in which the term is used, which will beevident to one of ordinary skill in the art. The materials may beotherwise oriented (rotated ninety degrees, inverted, etc.) and thespatially relative descriptors used herein interpreted accordingly.

As used herein, the terms “level” and “elevation” are spatially relativeterms used to describe one material's or feature's relationship toanother material(s) or feature(s) as illustrated in the figures,using—as a reference point—the primary surface of the substrate on whichthe reference material or structure is located. As used herein, a“level” and an “elevation” are each defined by a horizontal planeparallel to the primary surface. “Lower levels” and “lower elevations”are nearer to the primary surface of the substrate, while “higherlevels” and “higher elevations” are further from the primary surface.Unless otherwise specified, these spatially relative terms are intendedto encompass different orientations of the materials in addition to theorientation as depicted in the figures. For example, the materials inthe figures may be inverted, rotated, etc., with the spatially relative“elevation” descriptors remaining constant because the referencedprimary surface would likewise be respectively reoriented as well.

As used herein, the terms “comprising,” “including,” “having,” andgrammatical equivalents thereof are inclusive or open-ended terms thatdo not exclude additional, unrecited elements or method steps, but theseterms also include more restrictive terms “consisting of” and“consisting essentially of” and grammatical equivalents thereof.Therefore, a structure described as “comprising,” “including,” and/or“having” a material may be a structure that, in some embodiments,includes additional material(s) as well and/or a structure that, in someembodiments, does not include any other material(s). Likewise, acomposition (e.g., gas) described as “comprising,” “including,” and/or“having” a species may be a composition that, in some embodiments,includes additional species as well and/or a composition that, in someembodiments, does not include any other species.

As used herein, the term “may” with respect to a material, structure,feature, or method act indicates that such is contemplated for use inimplementation of an embodiment of the disclosure and such term is usedin preference to the more restrictive term “is” so as to avoid anyimplication that other, compatible materials, structures, features, andmethods usable in combination therewith should or must be excluded.

As used herein, “and/or” means and includes any and all combinations ofone or more of the associated listed items.

As used herein, the singular forms “a,” “an,” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise.

As used herein, a “(s)” at the end of a term means and includes thesingular form of the term and/or the plural form of the term, unless thecontext clearly indicates otherwise.

As used herein, the terms “configured” and “configuration” mean andrefer to a size, shape, material composition, orientation, andarrangement of a referenced material, structure, assembly, or apparatusso as to facilitate a referenced operation or property of the referencedmaterial, structure, assembly, or apparatus in a predetermined way.

The illustrations presented herein are not meant to be actual views ofany particular material, structure, sub-structure, region, sub-region,device, system, or stage of fabrication, but are merely idealizedrepresentations that are employed to describe embodiments of thedisclosure.

Embodiments are described herein with reference to cross-sectionalillustrations that are schematic illustrations. Accordingly, variationsfrom the shapes of the illustrations as a result, for example, ofmanufacturing techniques and/or tolerances, are to be expected. Thus,embodiments described herein are not to be construed as limited to theparticular shapes or structures as illustrated but may includedeviations in shapes that result, for example, from manufacturingtechniques. For example, a structure illustrated or described asbox-shaped may have rough and/or nonlinear features. Moreover, sharpangles that are illustrated may be rounded. Thus, the materials,features, and structures illustrated in the figures are schematic innature and their shapes are not intended to illustrate the precise shapeof a material, feature, or structure and do not limit the scope of thepresent claims.

The following description provides specific details, such as materialtypes and processing conditions, in order to provide a thoroughdescription of embodiments of the disclosed apparatus (e.g., devices,systems) and methods. However, a person of ordinary skill in the artwill understand that the embodiments of the apparatus and methods may bepracticed without employing these specific details. Indeed, theembodiments of the apparatus and methods may be practiced in conjunctionwith conventional semiconductor fabrication techniques employed in theindustry.

The fabrication processes described herein do not form a completeprocess flow for processing apparatus (e.g., devices, systems) or thestructures thereof. The remainder of the process flow is known to thoseof ordinary skill in the art. Accordingly, only the methods andstructures necessary to understand embodiments of the present apparatus(e.g., devices, systems) and methods are described herein.

Unless the context indicates otherwise, the materials described hereinmay be formed by any suitable technique including, but not limited to,spin coating, blanket coating, chemical vapor deposition (“CVD”), atomiclayer deposition (“ALD”), plasma enhanced ALD, physical vapor deposition(“PVD”) (e.g., sputtering), or epitaxial growth. Depending on thespecific material to be formed, the technique for depositing or growingthe material may be selected by a person of ordinary skill in the art.

Unless the context indicates otherwise, the removal of materialsdescribed herein may be accomplished by any suitable techniqueincluding, but not limited to, etching (e.g., dry etching, wet etching,vapor etching), ion milling, abrasive planarization, or other knownmethods.

In referring to the drawings, like numerals refer to like componentsthroughout. The drawings are not necessarily drawn to scale.

FIG. 1A schematically illustrates an upper deck reticle 102, and FIG. 1Bschematically illustrates a lower deck reticle 104, each of which may beused to form a microelectronic device structure 106 (e.g., a memorydevice structure, such as a 3D NAND memory device structure, for anapparatus (e.g., a memory device, such as a 3D NAND memory device),which may be included in a system), a hypothetical idealizedillustration of which is shown in FIG. 1C. The cross-section of FIG. 1Ccorresponds to the reticle patterns along section lines C-C of FIG. 1Aand FIG. 1B. More particularly, the upper deck reticle 102 of FIG. 1Amay be used to form (e.g., etch) an array of openings for pillars 108 ofan upper deck 110 of the microelectronic device structure 106 of FIG.1C, and the lower deck reticle 104 of FIG. 1B may be used to form (e.g.,etch) another array of openings for pillars 108 of the lower deck 112 ofthe microelectronic device structure 106 of FIG. 1C.

The openings for the pillars may be etched through stack structures 114that are supported by one or more base structure(s) 116. The basestructure(s) 116, below the stack structures 114, may include one ormore substrates or other base materials (e.g., polysilicon structure(s),conductive structure(s)). For example, in some embodiments, the stackstructures 114 (and the decks, including the lower deck 112) may beformed over a source material that may be formed of and include, e.g., asemiconductor material doped with one of P-type conductivity materials(e.g., polysilicon doped with at least one P-type dopant (e.g., boronions)) or N-type conductive materials (e.g., polysilicon doped with atleast one N-type dopant (e.g., arsenic ions, phosphorous ions, antimonyions)).

Each of the stack structures 114 includes vertically alternatinginsulative structures and other structures (e.g., sacrificialstructures, conductive structures) arranged in tiers, as discussedfurther below. To form the microelectronic device structure 106, thestack structure 114 of the lower deck 112 may be formed over the basestructure(s) 116 by, e.g., alternating formation (e.g., deposition) ofinsulative material(s) and other material(s) (e.g., sacrificialmaterial(s), conductive material(s)). Then, the lower deck reticle 104may be used to form (e.g., etch) pillar openings through the stackstructure 114 of the lower deck 112, according to the pattern of patternfeatures (e.g., circles) defined by the lower deck reticle 104. Forexample, the lower deck reticle 104 may be used to form (e.g., etch)openings in a hardmask with the openings corresponding to thearrangement of pattern features (e.g., circles) of the lower deckreticle 104. The openings of the hardmask may then be formed (e.g.,etched) into the stack structure 114 of the lower deck 112 to formpillar openings with the same respective arrangement of pillar openingscorresponding to the arrangement of pattern features (e.g., circles) ofthe lower deck reticle 104. Within the pillar openings of the lower deck112, the materials of the pillars 108 may then be formed.

The upper deck 110 may then be formed over the lower deck 112. Forexample, the stack structure 114 of the upper deck 110 may be formedover the stack structure 114 and the pillars 108 of the lower deck 112.Then, the upper deck reticle 102 may be used to form (e.g., etch) pillaropenings through the stack structure 114 of the upper deck 110 (e.g., ina same manner as described above with respect to the lower deck 112),according to the arrangement of pattern features (e.g., circles) definedby the upper deck reticle 102. Within the pillar openings of the upperdeck 110, the materials of the pillars 108 of the upper deck 110 maythen be formed.

Ideally, the pillar openings (and therefore the resulting pillars 108)of the lower deck 112 would exhibit the same pattern defined by thelower deck reticle 104, and the pillar openings (and resulting pillars108) of the upper deck 110 would exhibit the same pattern defined by theupper deck reticle 102. As such, if the upper deck reticle 102 and thelower deck reticle 104 define the same pattern of openings, asillustrated in FIG. 1A and FIG. 1B, and if the pillars 108 are trulyvertically oriented, then the pillars 108 of the upper deck 110 wouldperfectly align with the pillars 108 of the lower deck 112. Therefore,along an interface 118 between the upper deck 110 and the lower deck112, the lower surface of the pillars 108 of the upper deck 110 wouldfully align with the upper surfaces of the pillars 108 of the lower deck112. Moreover, this perfect alignment of the pillars 108 of the upperdeck 110 with the pillars 108 of the lower deck 112 would be consistentacross the whole of the pillar array, regardless of where located alongthe horizontal dimensions of the microelectronic device structure 106.For example, it may be expected that the pillars 108 of both the upperdeck 110 and the lower deck 112 may be truly vertical and in perfectalignment in both a left portion 120 and a right portion 122 of themicroelectronic device structure 106, regardless of what additionalfeatures or structures may be disposed between, such as in an areaadjacent line 124.

With such hypothetical, idealized fabrication of the microelectronicdevice structure 106, the pattern (e.g., arrangement of patternfeatures, such as the illustrate circles) of the upper deck reticle 102may be the same pattern as that of the lower deck reticle 104.Therefore, the same reticle may be used as both the upper deck reticle102 and the lower deck reticle 104. Moreover, the pattern of the formedarrays of pillars 108 may be the same, in horizontal cross-section, asthe pattern (e.g., of circles) defined by each of the reticles (e.g.,the upper deck reticle 102 and the lower deck reticle 104) at anyelevation of the pillars 108 through the upper deck 110 and the lowerdeck 112. Accordingly, the upper surface of each of the pillars 108wholly vertically overlaps with the lower surface of that pillar 108,and vertically-adjacent pillars 108 also wholly vertically overlap orunderlap one another. However, due to inherent limitations ofmicroelectronic device fabrication, the hypothetical, idealized,perfectly-vertical pillar structures may not be actualized. Apparatusand methods of embodiments, disclosed herein, nonetheless enablealignment of vertically-adjacent pillars 108 in a multi-deckmicroelectronic device structure.

With more particular reference to the materials and substructures of thepillars 108 and the stack structures 114, subsequent figures illustrate,in enlarged views, embodiments of such materials and substructures,represented by boxes 126 of FIG. 1C. It should be noted that theparticular locations for the boxes 126 illustrated in FIG. 1C, and insubsequent illustrations of microelectronic device structures, aremerely representational for any area where one of the pillars 108adjoins the stack structures 114. For example, the boxes 126 may be atan area of a memory cell of the microelectronic device structure 106.That is, strings of memory cells may vertically extend (e.g., in theZ-axis direction) through the stack structures 114, and the strings mayeach individually comprise multiple memory cells substantially alignedwith one another along elevations of the stack structures 114.Horizontally-adjacent strings of the memory cells may be separated fromeach other by, for example, the stack structures 114.

FIG. 2A through FIG. 2E illustrates, in enlarged views, memory cells 202of a microelectronic device structure (e.g., the microelectronic devicestructure 106 of FIG. 1C), in accordance with some embodiments of thedisclosure. FIG. 2A is a simplified enlarged view of boxes 126 of FIG.1C, illustrating the memory cell 202 in the vicinity of at least onetier 204 of an insulative structure 206 vertically adjacent anotherstructure 208 including and formed of at least one other material 210.

The insulative structures 206 may be formed of and include at least oneelectrically insulative material, such as one or more of the insulativematerial(s) discussed above (e.g., a dielectric oxide material, such assilicon dioxide). The insulative material(s) of the insulativestructures 206 may be the same or different than other insulativematerial(s) of the memory cell 202 and/or of the microelectronic devicestructure (e.g., the microelectronic device structure 106 of FIG. 1C).

The other material 210 of the other structures 208 may be formed of andinclude at least one material of a different composition than theneighboring insulative structures 206. For example, the other material210 of the other structures 208 may be formed of and include one or moreconductive material, such as a conductive metal-based material (asdescribed further below, e.g., in embodiments in which themicroelectronic device structure (e.g., the microelectronic devicestructure 106 of FIG. 1C) is formed via a so-called “replacement gate”process), or such as a conductive semiconductor-based material (asdescribed further below, e.g., in embodiments in which themicroelectronic device structure (e.g., the microelectronic devicestructure 106 of FIG. 1C) is formed in a so-called “floating gate”configuration).

In embodiments in which the microelectronic device structure (e.g., themicroelectronic device structure 106 of FIG. 1C) is formed by areplacement gate process, the materials of a respective deck of thestack structures 114 (FIG. 1C) may initially be formed by alternatelyforming (e.g., depositing) the insulative material(s) of the insulativestructures 206 and sacrificial material(s) as the other material 210 ofthe other structures 208. For example, the sacrificial material(s) maybe formed of and include, e.g., silicon nitride. After forming the stackstructures 114 (FIG. 1C), of a first deck (e.g., the lower deck 112(FIG. 1C)), with the insulative and sacrificial materials, the pillaropenings may be formed (e.g., etched) using the lower deck reticle 104(FIG. 1B), as described above.

Pillar materials may be formed in the etched pillar openings to form thepillars 108. The pillar materials may (e.g., of each pillar 108 and,therefore, of each memory cell 202) may include at least an insulativematerial 212 and a channel material 214.

The insulative material 212 may be formed of and include an electricallyinsulative material such as, for example, phosphosilicate glass (PSG),borosilicate glass (BSG), fluorosilicate glass (FSG),borophosphosilicate glass (BPSG), silicon dioxide, titanium dioxide,zirconium dioxide, hafnium dioxide, tantalum oxide, magnesium oxide,aluminum oxide, niobium oxide, molybdenum oxide, strontium oxide, bariumoxide, yttrium oxide, a nitride material, (e.g., silicon nitride(Si₃N₄)), an oxynitride (e.g., silicon oxynitride), a dielectric carbonnitride material (e.g., silicon carbon nitride (SiCN)), a dielectriccarboxynitride material (e.g., silicon carboxynitride (SiOCN)), orcombinations thereof In some embodiments, the insulative material 212comprises silicon dioxide.

The channel material 214 may be formed of and include one or more of asemiconductor material (e.g., at least one elemental semiconductormaterial, such as polycrystalline silicon; at least one III-V compoundsemiconductor material, at least one II-VI compound semiconductormaterial, at least one organic semiconductor material, GaAs, InP, GaP,GaN, other semiconductor materials), and an oxide semiconductormaterial. In some embodiments, the channel material 214 includesamorphous silicon or polysilicon. In some embodiments, the channelmaterial 214 comprises a doped semiconductor material.

The insulative material 212 may be horizontally adjacent the channelmaterial 214. In some embodiments, such as that of FIG. 2A, a tunneldielectric material 216 (also referred to as a “tunneling dielectricmaterial”) may be horizontally adjacent the channel material 214, amemory material 218 may be horizontally adjacent the tunnel dielectricmaterial 216, a dielectric blocking material 220 (also referred to as a“charge blocking material”) may be horizontally adjacent the memorymaterial 218, and a dielectric barrier material 222 may be horizontallyadjacent the dielectric blocking material 220.

The tunnel dielectric material 216 may be formed of and include adielectric material through which charge tunneling can be performedunder suitable electrical bias conditions, such as through hot-carrierinjection or by Fowler-Nordheim tunneling induced charge transfer. Thetunnel dielectric material 216 may be formed of and include one or moreof silicon oxide, silicon nitride, silicon oxynitride, dielectric metaloxides (e.g., aluminum oxide and hafnium oxide), dielectric metaloxynitride, dielectric metal silicates, alloys thereof, and/orcombinations thereof In some embodiments, the tunnel dielectric material216 comprises silicon dioxide or silicon oxynitride.

The memory material 218 may comprise a charge trapping material or aconductive material. The memory material 218 may be formed of andinclude one or more of silicon nitride, silicon oxynitride, polysilicon(e.g., doped polysilicon), a conductive material (e.g., tungsten,molybdenum, tantalum, titanium, platinum, ruthenium, and alloys thereof,or a metal silicide such as tungsten silicide, molybdenum silicide,tantalum silicide, titanium silicide, nickel silicide, cobalt silicide,or a combination thereof), a semiconductive material polycrystalline oramorphous semiconductor material including at least one elementalsemiconductor element or at least one compound semiconductor material,conductive nanoparticles (e.g., ruthenium nanoparticles), metal dots. Insome embodiments, the memory material 218 comprises silicon nitride.

The dielectric blocking material 220 may be formed of and include adielectric material such as, for example, one or more of an oxide (e.g.,silicon dioxide), a nitride (e.g., silicon nitride), and an oxynitride(e.g., silicon oxynitride), or another material. In some embodiments,the dielectric blocking material 220 comprises silicon oxynitride.

In some embodiments the tunnel dielectric material 216, the memorymaterial 218, and the dielectric blocking material 220 together may forma structure configured to trap a charge, such as, for example, anoxide-nitride-oxide (ONO) structure. In some such embodiments, thetunnel dielectric material 216 comprises silicon dioxide, the memorymaterial 218 comprises silicon nitride, and the dielectric blockingmaterial 220 comprises silicon dioxide.

The dielectric barrier material 222 may be formed of and include one ormore of a metal oxide (e.g., one or more of aluminum oxide, hafniumoxide, zirconium oxide, lanthanum oxide, yttrium oxide, tantalum oxide,gadolinium oxide, niobium oxide, titanium oxide), a dielectric silicide(e.g., aluminum silicide, hafnium silicate, zirconium silicate,lanthanum silicide, yttrium silicide, tantalum silicide), and adielectric nitride (e.g., aluminum nitride, hafnium nitride, lanthanumnitride, yttrium nitride, tantalum nitride).

In this and/or other embodiments of the disclosure, the pillar materialsmay be sequentially formed (e.g., deposited) in the pillar openings(e.g., the openings formed according to the pattern defined by areticle) from outer-most material (e.g., the dielectric barrier material222, according to the embodiment of FIG. 2A) to inner-most material(e.g., the insulative material 212).

After forming the pillar materials (and therefore the pillars 108) ofthe lower deck 112 (FIG. 1C), the other stack structure 114 of the upperdeck 110 (FIG. 1C) may be formed with alternating insulative material(s)of the insulative structures 206 and sacrificial material(s) as theother material 210 of the other structures 208. Then, the pillaropenings for the upper deck 110 may be formed (e.g., etched) using theupper deck reticle 102 (FIG. 1A), as described above, and additionalportions of the pillar materials may be formed in the pillar openings ofthe upper deck 110 (FIG. 1C).

After forming the pillars 108 of both the lower deck 112 (FIG. 1C) andthe upper deck 110 (FIG. 1C), the sacrificial material(s) (e.g., theother material 210), and therefore the other structures 208 may besubstantially removed (e.g., exhumed), and—as illustrated in FIG.2B—replaced with one or more conductive material(s) 224 to form memorycells 202′ of the microelectronic device structure (e.g., themicroelectronic device structure 106 (FIG. 1C)) with verticallyalternating insulative structures 206 and other structures 208, whereinthe other structures 208 are formed as conductive structures 226.Accordingly, the microelectronic device structure (e.g., themicroelectronic device structure 106 of FIG. 1C) may be formed by areplacement gate process, wherein FIG. 2A and FIG. 2B illustrate variousstages in the method of fabrication.

In other embodiments, in which the microelectronic device structure(e.g., the microelectronic device structure 106 of FIG. 1C) is formedwith “floating gates,” the other material(s) 210 of FIG. 2A may beformed initially as the conductive material(s) 224 with one or moresemiconductive material (e.g., doped polysilicon). Therefore, the otherstructures 208 may be free, or substantially free, of sacrificialmaterial, and the removal (e.g., exhumation) and replacement ofmaterials may be avoided after forming the pillars 108. Accordingly, themicroelectronic device structure (e.g., the microelectronic devicestructure 106 of FIG. 1C) may be formed by a floating gate process,wherein FIG. 2B illustrates a stage in the method of fabrication, andthe conductive material(s) 224 is formed of and includes polysilicondirectly vertically adjacent neighboring insulative structures 206.

Whether the memory cells 202 (FIG. 2A), and therefore themicroelectronic device structures (e.g., the microelectronic devicestructures 106 (FIG. 1C)), are formed with replacement gates (e.g., toform the memory cells 202′ (FIG. 2B)) or with floating gates, each ofthe formed memory cells 202 (e.g., the memory cell 202 of FIG. 2A, thememory cell 202′ of FIG. 2B, or the memory cell of any others of FIG. 2Cthrough FIG. 2E) may be located at an intersection of one of the otherstructures 208 (e.g., of one of the tiers 204 of the stack structure 114(FIG. 1C)) and one of the pillars 108 vertically extending through thestack structure 114 (FIG. 1C), the pillars 108 including at least thechannel material 214.

In some embodiments, the formed memory cells 202 (FIG. 2A) (e.g., memorycells 202′ (FIG. 2B)) include the dielectric channel material 214horizontally interposed between the insulative material 212 and thetiers 204 of the stack structures 114 (FIG. 1C). In some embodiments ofmemory cells, such as with the memory cell 202′ of FIG. 2B, thedielectric barrier material 222 may be horizontally adjacent one of thelevels of the other structures 208 (e.g., one of the conductivestructures 226) of one of the tiers 204 of the stack structure 114. Thechannel material 214 may be horizontally interposed between theinsulative material 212 and the tunnel dielectric material 216; thetunnel dielectric material 216 may be horizontally interposed betweenthe channel material 214 and the memory material 218; the memorymaterial 218 may be horizontally interposed between the tunneldielectric material 216 and the dielectric blocking material 220; thedielectric blocking material 220 may be horizontally interposed betweenthe memory material 218 and the dielectric barrier material 222; and thedielectric barrier material 222 may be horizontally interposed betweenthe dielectric blocking material 220 and the level of conductivestructure 226.

Although the memory cells (e.g., the memory cell 202 of FIG. 2A and thememory cell 202′ of FIG. 2B) have been described and illustrated ashaving a particular structure and composition, the disclosure is not solimited. FIG. 2C is a simplified, cross-sectional, elevational,enlargement of boxes 126 of FIG. 1C, illustrating a memory cell 202″ inaccordance with embodiments of the disclosure, wherein themicroelectronic device structure (e.g., the microelectronic devicestructure 106 of FIG. 1C) is formed by a replacement gate process. Oneor more (e.g., all) the memory cells 202 of FIG. 2A and/or the memorycells 202′ of FIG. 2B may be replaced with the memory cell 202″ of FIG.2C. With reference to FIG. 2C, the memory cell 202″ may include,multiple conductive materials within the conductive structures 226(e.g., within the other structures 208) of the tiers 204. For example,the conductive structures 226 may include a conductive material 228within a conductive liner material 230. During the replacement gateprocess, after removal (e.g., exhumation) of the sacrificial material ofthe other structures 208, the conductive liner material 230 may beformed first, on exposed surfaces of the vertically adjacent insulativestructures 206, and then the conductive material 228 formed verticallybetween portions of the conductive liner material 230. The conductiveliner material 230 may comprise, for example, a seed material enablingthe subsequent formation of the conductive material 228. The conductiveliner material 230 may be formed of and include, for example, a metal(e.g., titanium, tantalum), a metal nitride (e.g., tungsten nitride,titanium nitride, tantalum nitride), or another material. In someembodiments, the conductive liner material 230 comprises titaniumnitride.

In other embodiments, the conductive liner material 230 is not included,and the conductive material may be formed directly adjacent to and inphysical contact with the insulative structures 206, such with theconductive material(s) 224 of the memory cell 202′ of FIG. 2B, asdiscussed above.

With reference to FIG. 2D, illustrated in simplified cross-section is amemory cell 202″′ in accordance with additional embodiments of thedisclosure. One or more (e.g., all) of the memory cell 202 of FIG. 2A,the memory cell 202′ of FIG. 2B, and/or the memory cell 202″ of FIG. 2Cmay be replaced with the memory cell 202″′ of FIG. 2D. The memory cell202′″ may include the insulative material 212 and the channel material214, as described above, and may further include a first dielectricmaterial 232 (e.g., a tunnel dielectric material) horizontally adjacentthe channel material 214. A second dielectric material 234 (e.g., acharge trapping material) may be horizontally adjacent the firstdielectric material 232, and a third dielectric material 236 (e.g., acharge blocking material) may be horizontally adjacent the seconddielectric material 234 and the conductive material 228. In someembodiments, the first dielectric material 232 comprises an oxidematerial (e.g., silicon dioxide), the second dielectric material 234comprises a nitride material (e.g., silicon nitride), and the thirddielectric material 236 comprises an oxide material (e.g., silicondioxide). For clarity, in FIG. 2D, the conductive liner material 230(FIG. 2C) is not illustrated around the conductive material 228;however, in some embodiments, the memory cell 202″′ may further includesuch conductive liner material 230.

With reference to FIG. 2E, illustrated in simplified cross-section is amemory cell 202″″, in accordance with additional embodiments of thedisclosure, wherein the memory cell 202″″ may be configured as aso-called “floating gate” memory cell. One or more (e.g., all) of thememory cell 202 of FIG. 2A, the memory cell 202′ of FIG. 2B, the memorycell 202″ of FIG. 2C, and/or the memory cell 202′ may be replaced withthe memory cell 202″″ of FIG. 2E. In addition to the insulative material212 and the channel material 214, the memory cell 202″″ may include anelectrode structure 238, which may be referred to as a “floating gate.”The electrode structure 238 may comprise an electrically conductivematerial, such as, e.g., polysilicon and/or one or more of the materialsdescribed with respect to conductive material 228 (e.g., tungsten). Thememory cell 202″″ may further include a dielectric material 240, whichmay be referred to as a “gate dielectric” material. The dielectricmaterial 240 may comprise, for example, one or more of the materialsdescribed above with reference to the tunnel dielectric material 216. Insome embodiments, the dielectric material 240 comprises silicon dioxide.An other dielectric material 242 may be located around portions of theelectrode structure 238. The other dielectric material 242 may compriseone or more of the materials described above with reference to thetunnel dielectric material 216. In some embodiments, the otherdielectric material 242 has the same material composition as thedielectric material 240. The other dielectric material 242 may belocated between the electrode structure 238 and the conductive material228. For clarity, in FIG. 2E, the conductive liner material 230 (FIG.2C) is not illustrated around the conductive material 228. However, itwill be understood that in some embodiments, the memory cell 202″″ mayinclude the conductive liner material 230.

With returned reference to FIG. 1C, it may be intended that—using theupper deck reticle 102 of FIG. 1A and the lower deck reticle 104 of FIG.1B—forms each of the pillars 108 of the upper deck 110 and the lowerdeck 112, respectively, with identical and consistent form in a truevertical orientation, as illustrated. However, differences inneighboring material stresses due to, e.g., differences in neighboringstructures or the lack of neighboring structures (e.g., near edges of adevice structure), may result in some of the pillars 108 experiencingdifferent material strains than experienced by others of the pillars108. For example, with reference to FIG. 3, pillars in regions along anedge (e.g., periphery) of a die 302 (e.g., in left peripheral edgeregion 304, in right peripheral edge region 306), may exhibit morebending than do pillars further from the edge.

Pillar bending may not necessarily be isolated to only peripheral edgeregions of a die (e.g., the die 302). For example, with reference toFIG. 4, one or more portions of the die or other device structure mayinclude—in addition to pillar array regions (e.g., in left portion120)—regions with features other than pillar arrays, such as a staircaseregion 402 with at least one staircase structure 404 having steps 406defined by lateral ends of at least some of the tiers 204 (FIG. 2Athrough FIG. 2E) of the stack structures 114 of the decks (e.g., theupper deck 110 and/or the lower deck 112). In some embodiments, eachstep 406 of the staircase structure 404 may be defined by lateral endsof one of the insulative structures 206 (FIG. 2) and one of the otherstructures 208 (FIG. 2A through FIG. 2E) (e.g., one of the conductivestructures 226 (FIG. 2B through FIG. 2E)). However, the disclosure isnot so limited, and the steps 406 may be defined by more than one of theinsulative structures 206 and one of the other structures 208 (e.g., oneof the conductive structures 226).

Due to inherent material residual stresses or other imbalancesexperienced by the pillars 108 nearest the staircase region 402 (orother non-pillar-array features of the die 302 (FIG. 3), e.g., theperipheral edge of the die 302)—compared to pillars 108 further from thestaircase region 402 (or other non-pillar-array features of the die 302(FIG. 3)) and more central to the array of pillars—may exhibit a greateramount of bending. For example, as illustrated in FIG. 4, pillars 108more distal from the staircase region 402 may exhibit less bending(e.g., through the vertical height of the pillars 108) compared topillars 108 more proximal to the staircase region 402.Subsequently-formed pillars, such as the pillars 108 of the upper deck110, may therefore lead to the pillars 108 of the upper deck 110 beingmisaligned relative to the pillars 108 of the lower deck 112. Moreover,the amount of misalignment between respective, vertically-adjacentpillars 108 may vary over the width of the pillar array portion. Forexample, vertically-adjacent pillars 108 distal from the staircaseregion 402 may exhibit less misalignment, e.g., at area 408, compared tovertically-adjacent pillars 108 proximal to the staircase region 402,e.g., at area 410. This variation in amount of pillar bending, andtherefore amount of pillar misalignment along the interface 118 betweenthe upper deck 110 and the lower deck 112, increases the challenge ofresolving pillar misalignment across the whole of the pillar array and,e.g., across the whole of the die 302 (FIG. 3).

The apparatus and methods disclosed herein, in accordance withembodiments of the disclosure, may ensure substantial alignment, ofvertically-adjacent pillars 108, along interfaces (e.g., the interface118) of multi-deck microelectronic device structures, even when some ofthe pillars 108 exhibit a variety of pillar bending amounts through aportion of the pillar array.

In the figures discussed further below, left portions 120 and rightportions 122 of microelectronic device structures are illustrated onrespective sides of a line 124, wherein the line 124 may represent anon-pillar-array type feature (e.g., a staircase region, such as thestaircase region 402 of FIG. 4), and/or the outer sides of theillustrated structures (e.g., the sides distal from the line 124), mayalternatively represent a non-pillar-array type feature (e.g., an edgeof a die, such as a peripheral edge of the die 302 of FIG. 3). In someembodiments, the line 124 and/or distal edges of the illustratedstructures may otherwise represent a continuation of the pillar arraythat includes the illustrated pillars 108. In some embodiments, the line124 may represent a centerline of the die 302 (FIG. 3) on which theillustrated structures are fabricated.

With reference to FIG. 5A through FIG. 5C, the upper deck reticle 102and the lower deck reticle 104 may be used to form arrays of pillars 108of a multi-deck structure. The upper deck reticle 102 and the lower deckreticle 104 may each define a pattern of substantially evenly-spacedpattern features (e.g., circles), e.g., spaced a first distance 502, forpillar openings to be formed. In some embodiments, the upper deckreticle 102 and the lower deck reticle 104 may define the same patternand/or may be the same physical reticle apparatus that can be used foreach of the decks of a microelectronic device structure 504 to beformed. Whether the same apparatus or different apparatus, the lowerdeck reticle 104 may be used to form the pillars 108 of the lower deck112, and the upper deck reticle 102 may be used to form the pillars 108of the upper deck 110 of the microelectronic device structure 504.

It may be that some of the pillars 108 of the pillar array of the lowerdeck 112, such as the pillars 108 nearest an edge of the array and/ornearest a non-pillar-feature (e.g., which may be represented by line124) may exhibit a greater amount of pillar bending, e.g., in upperelevations of the pillar 108, than pillars 108 furthest from such edgeor other feature (e.g., furthest from line 124).

The subsequently formed pillars 108 of the upper deck 110 may thereforebe more aligned in some areas (e.g., area 408) than in others (e.g.,area 410), and the amount of misalignment may vary (e.g., increase,decrease, or otherwise change in amount) across the respective portion(e.g., the left portion 120, the right portion 122). Therefore, even ifthe lower elevations of the pillars 108 of the lower deck 112 are spaceddistance 502, in accordance with the lower deck reticle 104, and even ifat least the lower elevations of the pillars 108 of the upper deck 110are spaced distance 502, in accordance with the upper deck reticle 102,the bottom surfaces of the pillars 108 of the upper deck 110 may or maynot be in alignment with the upper surfaces of the pillars 108 of thelower deck 112 with which there was intended to be a surface-to-surfacecontact along the interface 118.

By fabricating structures such as the microelectronic device structure504 of FIG. 5C one or more times, using “initial” reticles (e.g., upperdeck reticle 102, lower deck reticle 104), the amount and variation ofmisalignment across the interface 118, may be observed and learned.Based on the observed and learned misalignment information, one or more“tailored” reticles may be designed, fabricated, and/or otherwiseprovided for re-fabricating the microelectronic device structure withvertical alignment of the pillars along the interface 118, even withsome of the pillars of one or more of the decks of the multi-deckstructure, exhibiting a variety of bending amounts.

In some embodiments, all of the decks of the multi-deck structure may befabricated and the resulting pillar misalignment observed, using theinitial reticles, before tailored reticles are designed, fabricated,and/or otherwise provided to fabricate a new embodiment of themulti-deck structure with improved alignment of vertically-adjacentpillars. In other embodiments, fewer than all of the decks of themulti-deck structure may be fabricated and the resulting pillarmisalignment observed, using the initial reticle(s), before tailoredreticles are designed, fabricated, and/or otherwise provided tofabricate the multi-deck structure with improved pillar alignment. Forexample, both the lower deck 112 and the upper deck 110 of themicroelectronic device structure 504 of FIG. 5C may be fabricated, oneor more times, and the pillar misalignment measured across whateverportions (e.g., the left portion 120, the right portion 122) of themicroelectronic device structure 504 exhibit pillar bending, with themisalignment measurement being, e.g., a lateral distance along theinterface 118 between a lateral center of an upper surface of eachpillar 108 of the lower deck 112 and a lateral center of a lower surfaceof a respective pillar 108 of the upper deck 110. In other embodiments,the lower deck 112 may be fabricated, one or more times, and the pillarmisalignment measured across the portions (e.g., the left portion 120,the right portion 122) exhibiting pillar bending, without yetfabricating the upper deck 110. In such embodiments, the misalignmentmeasurement may be based on, e.g., a lateral distance along theinterface 118 between a lateral center of an upper surface of eachpillar 108 of the lower deck 112 and the intended location for thelateral center of the pillar 108 based on the distance 502 defined bythe initial reticle used to form the pillar array of the lower deck 112(e.g., the lower deck reticle 104).

After fabricating at least one deck (e.g., the lower deck 112) of themulti-deck structure, e.g., the microelectronic device structure 504,and observing and determining the pillar misalignment across at leastwhatever portion(s) exhibit pillar bending, the reticle pattern for atleast one of the decks—whether a deck in which pillars exhibit pillarbending or one in which pillars do not exhibit pillar bending—may beredesigned with a pattern (e.g., for pillar openings) tailored toaccount for the observed pillar misalignment.

For example, based on the observed pillar misalignment from fabricating,one or more times, the microelectronic device structure 504 of FIG. 5C,a tailored upper deck reticle 602, illustrated in FIG. 6A, may bedesigned, fabricated, or otherwise provided so that, uponre-refabricating the pillars 108 of the lower deck 112 using the lowerdeck reticle 104, fabricating the pillars 108 of the upper deck 110using the tailored upper deck reticle 602 enables consistentpillar-to-pillar alignment along the interface 118, as illustrated inFIG. 6C. More particularly, because the pillars 108 of the lower deck112 exhibit pillar bending away from line 124, with the pillar bendingconsistently decreasing across the left portion 120 and the rightportion 122 the further the pillar 108 is from the line 124, compressingthe arrangement of pattern features toward outer edges of the tailoredupper deck reticle 602—such that the pattern features are substantiallyevenly spaced by a distance 604 that is less than the evenly spaceddistance 502 of the lower deck reticle 104—the pillars 108 of the upperdeck 110 may be formed with consistent alignment along the interface 118to the pillars 108 of the lower deck 112, as indicated at areas 608.Notably, at the lesser distance 604 compared to distance 502, thepattern features of the tailored upper deck reticle 602 are more denselyarranged (e.g., compressed) relative to the pattern features of thelower deck reticle 104. Therefore, along the horizontal area of theupper deck 110 that includes the array of pillars 108, the upper deck110 has a greater pillar density compared to the pillar density of thehorizontal area of the lower deck 112 that includes a correspondingarray of pillars 108.

In other embodiments, rather than—or in addition to—tailoring thepattern of the lower deck reticle, the pattern of the upper deck reticlemay be tailored to accommodate for pillar pending in the lower deck 112.For example, with reference to FIG. 7A through FIG. 7C, the same upperdeck reticle 102 may be used along with a tailored lower deck reticle702—defining an expanded arrangement of pattern features, substantiallyevenly spaced at distance 704 that is greater than the distance 502 usedfor the upper deck reticle 102—to form a microelectronic devicestructure 706 with aligned vertically-adjacent pillars 108. Accordingly,the pattern features of the tailored lower deck reticle 702 may be lessdensely arranged that the pattern features of the upper deck reticle102. Correspondingly, along the horizontal area of the lower deck 112that includes the array of pillars 108, the lower deck 112 has a lowerpillar density compared to the pillar density of the horizontal area ofthe upper deck 110 that includes the corresponding array of pillars 108.

With reference to FIG. 8A through FIG. 8C, in some embodiments, theobserved pillar bending using initial reticles (e.g., upper deck reticle102 of FIG. 8A, lower deck reticle 104 of FIG. 8B) may be more inwardlydirected, toward line 124 (e.g., toward a non-array feature of theapparatus), as in a microelectronic device structure 802 of FIG. 8C,than outwardly directed as in FIG. 5C. Nonetheless, from observingpillar misalignment resulting from fabricating, one or more times, themicroelectronic device structure 802, one or more of the reticles may beredesigned, re-fabricated, or otherwise provided to enable futurefabrication of the multi-deck structure with improved pillar alignment.

As illustrated in the microelectronic device structure 802 of FIG. 8C,lower elevations of each of the pillars 108 may be substantially evenlyspaced at distance 502, corresponding to the distance 502 defined by theinitial reticles (e.g., the upper deck reticle 102 of FIG. 8A, the lowerdeck reticle of FIG. 8B). However, the pillars 108 of, e.g., the lowerdeck 112 may exhibit significant pillar bending in some areas (e.g.,area 408) and less pillar bending in other areas (e.g., area 410), whichmay lead to vertically-adjacent pillars 108 being misaligned (e.g., atarea 410) or aligned with unintended pillars 108 of the verticallyadjacent deck (e.g., at area 408).

To enable improved pillar-to-pillar alignment of vertically-adjacentpillars—without necessitating amelioration of the pillar bendingexhibited by the pillars 108 of the lower deck 112—a tailored upper deckreticle 902, as illustrated in FIG. 9A, may be designed, fabricated, orotherwise provided to tailor the arrangement of the pattern featuresthereof—and therefore the resulting arrangement and density of thepillars 108 of the upper deck 110, to that which is defined by andresults from use of the lower deck reticle 104 (FIG. 9B) to form thepillars 108 of the lower deck 112. For example, the tailored upper deckreticle 902 may define an arrangement of pattern features (e.g.,circles) with progressing density. That is, pattern features nearestouter edges of the tailored upper deck reticle 902 may be less denselyspaced (e.g., at distance 906, which is greater than distance 502 of thelower deck reticle 104) than pattern features furthest from the outeredges of the tailored upper deck reticle 902, which may be more denselyspaced (e.g., at distance 904, which is less than distance 502 of thelower deck reticle 104). Using such tailored upper deck reticle 902 toform the pillars 108 of the upper deck 110, the upper deck 110 may havea pillar array with progressing pillar density, increasing in pillardensity with lateral distance relative to the line 124. Nonetheless,because the progressed pattern feature density of the tailored upperdeck reticle 902 is tailored to the pillar bending exhibited by thepillars 108 of the lower deck 112—based on the prior-fabricated andprior-observed microelectronic device structure 802 of FIG. 8C—aresulting microelectronic device structure 908 (FIG. 9C), fabricatedusing the tailored upper deck reticle 902 includes aligned,vertically-adjacent pillars 108 along the interface 118 between theupper deck 110 and the lower deck 112 (see areas 608), even though lowerelevations of the pillars 108 of the lower deck 112 are substantiallyevenly spaced at distance 502 while upper elevations of the pillars 108of the lower deck 112 (and at least the lower elevations of the pillars108 of the upper deck 110) are progressively more densely spaced,relative to the line 124, including spacing at distance 904 proximal tothe line 124 and spacing at distance 906 distal from the line 124.

With reference to FIG. 10A through FIG. 10C, illustrated is the upperdeck reticle 102, which may or may not be specifically tailored in lightof prior structure fabrications; and a tailored lower deck reticle 1002with a progression of pattern feature density that increases towardouter edges of the tailored lower deck reticle 1002. Therefore, patternfeatures nearer outer edges of the tailored lower deck reticle 1002 maybe at a distance 1004 that is less than the distance 502 at which thepattern features of the upper deck reticle 102 are substantially evenlyspaced, while pattern features further from outer edges of the tailoredlower deck reticle 1002 may be at a distance 1006 that is greater thanthe distance 502. Using the tailored lower deck reticle 1002 of FIG. 10Band the upper deck reticle 102 of FIG. 10A, a microelectronic devicestructure 1008 of FIG. 10B may be fabricated with improved alignment ofvertically-adjacent pillars 108, even with the pillars 108 of the lowerdeck 112 exhibiting varying degrees of pillar bending and a progressionof pillar density (e.g., at least in lower elevations of the lower deck112) with increased lateral distance from the line 124, and even withthe pillars 108 of the upper deck 110 being substantially evenly spacedand of consistent pillar density throughout the pillar array of theupper deck 110.

With reference to FIG. 11A through FIG. 11C, illustrated is amicroelectronic device structure 1102, which may be fabricated using theupper deck reticle 102 and the lower deck reticle 104 withsubstantially-even pattern feature density, at distance 502. From one ormore fabrications of the microelectronic device structure 1102 of FIG.11C, it may be observed that pillar bending and pillar misalignmentgradually increases, in upper elevations of the pillars 108 of the lowerdeck 112, with increased distance from the line 124 (see area 408compared to area 410), even though lower elevations of the pillars 108of both the lower deck 112 and the upper deck 110 may be substantiallyevenly spaced at distance 502.

With reference to FIG. 12A through FIG. 12C, illustrated is a tailoredupper deck reticle 1202 with a compressed pattern feature density,relative to that of the lower deck reticle 104. For example, the patternfeatures of the tailored upper deck reticle 1202 may becompressed—relative to the arrangement of pattern features in theinitial reticle (e.g., the upper deck reticle 102 of FIG. 11A) and/orrelative to the arrangement of pattern features in the lower deckreticle 104—away from outer edges of the tailored upper deck reticle1202, with substantially even spacing at distance 1204, which may beless than the distance 502 at which the pattern features of the lowerdeck reticle 104 are substantially evenly spaced. Using the tailoredupper deck reticle 1202 of FIG. 12A and the lower deck reticle 104 ofFIG. 12B, a microelectronic device structure 1206 may be fabricated withimproved alignment of vertically-adjacent pillars 108, even with thepillars 108 of the lower deck 112 exhibiting varying degrees of pillarbending and a lower pillar density (e.g., at least in lower elevationsof the pillar array portion of the lower deck 112) compared to thepillars 108 of the upper deck 110.

With reference to FIG. 13A through FIG. 13C, illustrated is the upperdeck reticle 102 (e.g., the initial reticle used to form at least theupper deck 110 of the microelectronic device structure 1102 of FIG. 11C,from which pillar misalignment was observed and measured), and atailored lower deck reticle 1302 with an expanded arrangement of patternfeatures, which may be substantially evenly spaced at a distance 1304that may be greater than the distance 502 at which the pattern featuresof the upper deck reticle 102 are substantially evenly spaced. Thus, thepattern feature density of the tailored lower deck reticle 1302 is lessthan the pattern feature density of the upper deck reticle 102. Usingthe upper deck reticle 102 of FIG. 13A and the tailored lower deckreticle 1302 of FIG. 13B, a microelectronic device structure 1306 may befabricated with improved alignment of vertically-adjacent pillars 108,even with the pillars 108 of the lower deck 112 exhibiting varyingdegrees of pillar bending and a lower pillar density (e.g., at least inlower elevations of the pillar array portion of the lower deck 112)compared to the pillars 108 of the upper deck 110.

With reference to FIG. 14A through FIG. 14C, using the upper deckreticle 102 and the lower deck reticle 104 with pattern featuressubstantially evenly spaced at distance 502, a resulting microelectronicdevice structure 1402 may exhibit varying amounts of pillar bending andmisalignment across the pillar array portions of the lower deck 112,such as with outwardly-bending pillars 108.

With reference to FIG. 15A through FIG. 15C, a tailored upper deckreticle 1502 may be configured—in light of the observed pillarmisalignment from fabricating the microelectronic device structure 1402of FIG. 14C one or more times—with an arrangement of pattern featuresthat is progressively more density nearer outer edges of the tailoredupper deck reticle 1502. For example, pattern features nearer an outeredge of the tailored upper deck reticle 1502 may be spaced at a lateraldistance 1504 that is less than the distance 502 for substantiallyevenly spacing pattern features in the lower deck reticle 104, whilepattern features further the outer edge of the tailored upper deckreticle 1502 may be spaced at a lateral distance 1506 that is greaterthan the distance 502 used in the lower deck reticle 104. Using thetailored upper deck reticle 1502 of FIG. 15A and the lower deck reticle104 of FIG. 15B, a microelectronic device structure 1508 may befabricated with improved alignment of vertically-adjacent pillars 108,even with the pillars 108 of the lower deck 112 exhibiting varyingdegrees of pillar bending and a substantially-consistent pillar densityand substantially-even pillar spacing (e.g., at least in lowerelevations of the pillar array portion of the lower deck 112) comparedto the pillars 108 of the upper deck 110 being progressively lessdensely arranged proximal to the line 124 than distal from the line 124.

Alternatively or additionally, the observed pillar misalignment from themicroelectronic device structure 1402 of FIG. 14C may, additionally oralternatively, be ameliorated—with reference to FIG. 16A through FIG.16C—by tailoring the pattern features for a tailored lower deck reticle1602, with a progressively expanding pattern feature density, withdecreased lateral distance from a respective outer edge of the tailoredlower deck reticle 1602, even while leaving the pattern features of theupper deck reticle 102 substantially evenly spaced at distance 502. Forexample, in the tailored lower deck reticle 1602, pattern featuresfurther from the outer edge may be spaced at a distance 1604 that isless than distance 502, while pattern features nearer to the outer edgemay be spaced at a distance 1606 that is greater than distance 502. Aresulting microelectronic device structure 1608 may have improved pillaralignment along the interface 118 between the lower deck 112 and theupper deck 110, even with the pillar density in the lower deck 112varying (e.g., at least in lower elevations of the pillars 108 of thelower deck 112)—with progressively lower pillar density with increasedlateral distance from the line 124—across the pillar array of the lowerdeck 112, while the pillar density in the upper deck 110 issubstantially consistent (e.g., at least in lower elevations of thepillars 108 of the upper deck 110) across the pillar array of the upperdeck 110.

While the microelectronic device structures of FIG. 5C through FIG. 16Cillustrate upper decks 110 with substantially vertical pillars 108, inother embodiments, the pillars 108 of the upper deck 110 may alsoexhibit pillar bending in upper elevations thereof. Such pillar bendingin the pillars 108 of the upper deck 110 may be the same or different asthe pillar pending exhibited by the pillars 108 of the lower deck 112.Nonetheless, because the pillars 108 are to align (e.g., be in physicalcontact with one another) along the interface 118 between the upper deck110 and the lower deck 112, essentially only the relative disposition ofthe lower elevations of the pillars 108 of the upper deck 110 and theupper elevations of the pillars 108 of the lower deck 112 are, alone,determinative of the tailoring implemented in the reticle(s) to improvealignment of the vertically-adjacent pillars 108.

For example, with reference to FIG. 17A through FIG. 17C, use of theupper deck reticle 102 and the lower deck reticle 104 to form amicroelectronic device structure 1702 may result in the pillars 108 ofthe lower deck 112 exhibiting varying degrees of pillar bendingoutwardly away from line 124, and may also result in the pillars 108 ofthe upper deck 110 exhibiting substantially the same varying degrees ofpillar bending outwardly away from line 124. With reference to FIG. 18Athrough FIG. 18C, the tailored upper deck reticle 602, described abovewith respect to FIG. 6A through FIG. 6C, may then be used with the lowerdeck reticle 104, to form a microelectronic device structure 1802 withthe same improved pillar alignment along the interface 118 as describedabove with respect to FIG. 6C, but with the pillars 108 of the upperdeck 110 exhibiting inward (e.g., toward line 124) pillar bending (e.g.,in upper elevations thereof) that decreases with increased lateraldistance from line 124. Alternatively, with reference to FIG. 19Athrough FIG. 19C, the upper deck reticle 102 and the tailored lower deckreticle 702 (described above with respect to FIG. 7A through FIG. 7C)may be used to form a microelectronic device structure 1902 with thesame improved pillar alignment along the interface 118 as describedabove with respect to FIG. 7C, but with the pillars 108 of the upperdeck 110 exhibiting inward pillar bending (e.g., in upper elevationsthereof) that decreases with increased lateral distance from line 124.

As another example, with reference to FIG. 20A through FIG. 20C, use ofthe upper deck reticle 102 and the lower deck reticle 104 to form amicroelectronic device structure 2002 may result in the pillars 108 ofthe lower deck 112 exhibiting varying degrees of pillar bendingoutwardly away from line 124, and may also result in the pillars 108 ofthe upper deck 110 exhibiting varying degrees of pillar bending inwardlytoward line 124. With reference to FIG. 21A through FIG. 21C, thetailored upper deck reticle 602, described above with respect to FIG. 6Athrough FIG. 6C, may then be used with the lower deck reticle 104, toform a microelectronic device structure 2102 with the same improvedpillar alignment along the interface 118 as described above with respectto FIG. 6C, but with the pillars 108 of the upper deck 110 exhibitinginward pillar bending (e.g., in upper elevations thereof) that increaseswith increased lateral distance from line 124. Alternatively, withreference to FIG. 22A through FIG. 22C, the upper deck reticle 102 andthe tailored lower deck reticle 702 (described above with respect toFIG. 7A through FIG. 7C) may be used to form a microelectronic devicestructure 2202 with the same improved pillar alignment along theinterface 118 as described above with respect to FIG. 7C, but with thepillars 108 of the upper deck 110 exhibiting inward pillar bending(e.g., in upper elevations thereof) that increases with increasedlateral distance from line 124.

As a further example, with reference to FIG. 23A through FIG. 23C, useof the upper deck reticle 102 and the lower deck reticle 104 to form amicroelectronic device structure 2302 may result in the pillars 108 ofthe lower deck 112 exhibiting varying degrees of pillar bending inwardlytoward line 124, and may also result in the pillars 108 of the upperdeck 110 exhibiting substantially the same varying degrees of pillarbending inwardly toward line 124. With reference to FIG. 24A throughFIG. 24C, the tailored upper deck reticle 902, described above withrespect to FIG. 9A through FIG. 9C, may then be used with the lower deckreticle 104, to form a microelectronic device structure 2402 with thesame improved pillar alignment along the interface 118 as describedabove with respect to FIG. 9C, but with the pillars 108 of the upperdeck 110 exhibiting inward (e.g., toward line 124) pillar bending (e.g.,in upper elevations thereof) that increases with increased lateraldistance from line 124. Alternatively, with reference to FIG. 25Athrough FIG. 25C, the upper deck reticle 102 and the tailored lower deckreticle 1002 (described above with respect to FIG. 10A through FIG. 10C)may be used to form a microelectronic device structure 2502 with thesame improved pillar alignment along the interface 118 as describedabove with respect to FIG. 10C, but with the pillars 108 of the upperdeck 110 exhibiting inward pillar bending (e.g., in upper elevationsthereof) that increases with increased lateral distance from line 124.

As still a further example, with reference to FIG. 26A through FIG. 26C,use of the upper deck reticle 102 and the lower deck reticle 104 to forma microelectronic device structure 2602 may result in the pillars 108 ofthe lower deck 112 exhibiting varying degrees of pillar bendingoutwardly away from line 124, and may also result in the pillars 108 ofthe upper deck 110 exhibiting varying degrees of pillar bending inwardlytoward line 124. With reference to FIG. 27A through FIG. 27C, thetailored upper deck reticle 1502, described above with respect to FIG.15A through FIG. 15C, may then be used with the lower deck reticle 104,to form a microelectronic device structure 2702 with the same improvedpillar alignment along the interface 118 as described above with respectto FIG. 15C, but with the pillars 108 of the upper deck 110 exhibitinginward pillar bending (e.g., in upper elevations thereof) that varies(e.g., first increasing then decreasing) with increased lateral distancefrom line 124. Alternatively, with reference to FIG. 28A through FIG.28C, the upper deck reticle 102 and the tailored lower deck reticle 1602(described above with respect to FIG. 16A through FIG. 16C) may be usedto form a microelectronic device structure 2802 with the same improvedpillar alignment along the interface 118 as described above with respectto FIG. 16C, but with the pillars 108 of the upper deck 110 exhibitinginward pillar bending (e.g., in upper elevations thereof) that varies(e.g., first increasing then decreasing) with increased lateral distancefrom line 124.

While the illustrated microelectronic device structures described aboveinclude two decks (e.g., the upper deck 110 and the lower deck 112) withpillar arrays of differing pillar density and at least one tailoredreticle to enable improved pillar alignment along one interface (e.g.,the interface 118 between the upper deck 110 and the lower deck 112),the same methods and apparatus described above may be implemented toimprove feature-to-feature (e.g., pillar-to-pillar, pillar-to-contact)alignment with additional decks (e.g., a third deck above the upper deck110) or additional features of the microelectronic device structures.

For example, with reference to FIG. 29, a microelectronic devicestructure 2902 may be formed to include an array of conductive contacts2904 (e.g., bit contacts) patterned (e.g., formed) with an arrangementof the conductive contacts 2904 substantially matching an arrangement ofupper surfaces of the pillars 108 of the upper deck 110 of, e.g., themicroelectronic device structure 606 of FIG. 6C. Alternatively, withreference to FIG. 30, a microelectronic device structure 3002 may beformed to include an array of the conductive contacts 2904 patternedwith an arrangement substantially matching that of the upper surfaces ofthe pillars 108 of the upper deck 110 of, e.g., the microelectronicdevice structure 706 of FIG. 7C. Accordingly, the microelectronic devicestructure 2902 of FIG. 29 and/or the microelectronic device structure3002 of FIG. 30 may include an array of pillars 108 in the lower deck112 that exhibits a different feature density (e.g., a lesser pillardensity) than a feature density of both an array of pillars 108 in theupper deck 110 and an array of conductive contacts 2904 above the upperdeck 110.

For another example, with reference to FIG. 31, a microelectronic devicestructure 3102 may be formed to include an array of the conductivecontacts 2904 patterned with an arrangement substantially matching apreviously-observed arrangement of upper surfaces of the pillars 108 ofthe upper deck 110 of, e.g., the microelectronic device structure 908(FIG. 9C). Alternatively, with reference to FIG. 32, a microelectronicdevice structure 3202 may be formed to include an array of theconductive contacts 2904 patterned with an arrangement substantiallymatching that of the upper surfaces of the pillars 108 of the upper deck110 of, e.g., the microelectronic device structure 1008 (FIG. 10C).Accordingly, the microelectronic device structure 3102 of FIG. 31 and/orthe microelectronic device structure 3202 of FIG. 32 may includemultiple decks, each including an array of pillars 108, with a pillardensity of at least one of the decks progressively varying (e.g., withdecreasing pillar density with increased lateral distance from line 124,as with the upper deck 110 of FIG. 31, and as with increasing pillardensity with increased lateral distance from line 124, as with the lowerdeck 112 of FIG. 32) across at least a portion of the respective pillararray, while the pillar density of a vertically-adjacent deck issubstantially consistent across the respective pillar array, at least inlower elevations of the pillars 108 (e.g., as with the lower deck 112 ofFIG. 31; as with the upper deck 110 of FIG. 32). In such structures, thefeature density of the conductive contacts 2904 may be eitherprogressively varying (e.g., with decreasing feature density withincreased lateral distance from line 124, as in FIG. 31) or may besubstantially consistent across the respective array of the conductivecontacts 2904 (e.g., as in FIG. 32), but at least differs from thepillar density of one of the decks of the structure.

With reference to FIG. 33, a microelectronic device structure 3302 maybe formed to include an array of the conductive contacts 2904 patternedwith an arrangement substantially matching that of the upper surfaces ofthe pillars 108 of the upper deck 110 of, e.g., the microelectronicdevice structure 1206 of FIG. 12C. Alternatively, with reference to FIG.34, a microelectronic device structure 3402 may be formed to include anarray of the conductive contacts 2904 patterned with an arrangementsubstantially matching that of the upper surfaces of the pillars 108 ofthe upper deck 110 of, e.g., the microelectronic device structure 1306of FIG. 13C. Accordingly, the microelectronic device structure 3302 ofFIG. 33 and/or the microelectronic device structure 3402 of FIG. 34 mayinclude multiple decks, each including an array of pillars 108, whereinthe pillars 108 are substantially evenly spaced across the respectivearray, but wherein a pillar density of the pillar array of the lowerdeck 112 is less than the pillar density of the pillar array of theupper deck 110 and less than the feature density of the conductivecontacts 2904 of the conductive contact array.

With reference to FIG. 35, a microelectronic device structure 3502 maybe formed to include an array of the conductive contacts 2904 patternedwith an arrangement substantially matching a previously-observedarrangement of upper surfaces of the pillars 108 of the upper deck 110of, e.g., the microelectronic device structure 1508 of FIG. 15C.Alternatively, with reference to FIG. 36, a microelectronic devicestructure 3602 may be formed to include an array of the conductivecontacts 2904 patterned with an arrangement substantially matching thatof the upper surfaces of the pillars 108 of the upper deck 110 of, e.g.,the microelectronic device structure 1608 of FIG. 16C. Accordingly, themicroelectronic device structure 3502 of FIG. 35 and/or themicroelectronic device structure 3602 of FIG. 36 may include multipledecks, each including an array of pillars 108, with a pillar density ofat least one of the decks progressively varying (e.g., with increasingpillar density (e.g., at least with respect to lower elevations of thepillars 108) with increased lateral distance from line 124, as with theupper deck 110 of FIG. 35; with decreasing pillar density with increasedlateral distance from line 124, as with the lower deck 112 of FIG. 36)across at least a portion of the respective pillar array, while thepillar density of a vertically-adjacent deck is substantially consistentacross the respective pillar array, at least in lower elevations of thepillars 108 (e.g., as with the lower deck 112 of FIG. 35; as with theupper deck 110 of FIG. 36). In such structures, the feature density ofthe conductive contacts 2904 may be either progressively varying (e.g.,with increasing feature density with increased lateral distance fromline 124, as in FIG. 35) or may be substantially consistent across therespective array of the conductive contacts 2904 (e.g., as in FIG. 36),but at least differs from the pillar density of one of the decks of thestructure.

With reference to FIG. 37, a microelectronic device structure 3702 maybe formed to include an array of the conductive contacts 2904 patternedwith an arrangement substantially matching that of the upper surfaces ofthe pillars 108 of the upper deck 110 of, e.g., the microelectronicdevice structure 1802 of FIG. 18C, such that the conductive contacts2904 may be substantially evenly spaced at distance 3704, with asubstantially consistent feature density across the array of theconductive contacts 2904. In light of pillar bending of exhibited by thepillars 108 of the upper deck 110, the distance 3704 of the spacing ofthe conductive contacts 2904 may be less than the distance 604 of thespacing of the pillars 108 of the upper deck 110, and therefore alsoless than the distance 502 of the spacing of the pillars 108 of thelower deck 112. Alternatively, with reference to FIG. 38, amicroelectronic device structure 3802 may be formed to include an arrayof the conductive contacts 2904 patterned with an arrangementsubstantially matching that of the upper surfaces of the pillars 108 ofthe upper deck 110 of, e.g., the microelectronic device structure 1902of FIG. 19C, such that the conductive contacts 2904 may be substantiallyevenly spaced at distance 3804, with a substantially consistent featuredensity across the array of conductive contacts 2904. The distance 3804may be less than the distance 604, which may be less than distance 704.Accordingly, the microelectronic device structure 3702 of FIG. 37 and/orthe microelectronic device structure 3802 of FIG. 38 may includemultiple decks, each including an array of pillars 108, wherein thepillars 108 are substantially evenly spaced across the respective array,but wherein a pillar density of the pillars 108 of the lower deck isless than a pillar density of the pillars 108 of the upper deck 110,which is less than a feature density of the conductive contacts 2904, atleast with respect to the lower elevations of the pillars 108 and theconductive contacts 2904.

As another example, with reference to FIG. 39, a microelectronic devicestructure 3902 may be formed to include an array of the conductivecontacts 2904 patterned with an arrangement substantially matching thatof the upper surfaces of the pillars 108 of the upper deck 110 of, e.g.,the microelectronic device structure 2102 of FIG. 21C, such that theconductive contacts 2904 may be substantially evenly spaced at distance3904, with a substantially consistent feature density across the arrayof the conductive contacts 2904. The distance 3904 may be less than thedistance 604, which may be less than the distance 502. Alternatively,with reference to FIG. 40, a microelectronic device structure 4002 maybe formed to include an array of the conductive contacts 2904 patternedwith an arrangement substantially matching that of the upper surfaces ofthe pillars 108 of the upper deck 110 of, e.g., the microelectronicdevice structure 2202 of FIG. 22C, such that the conductive contacts2904 may be substantially evenly spaced at distance 4004, with asubstantially consistent feature density across the array of conductivecontacts 2904. The distance 4004 may be less than the distance 502,which may be less than distance 704. Accordingly, like themicroelectronic device structure 3702 of FIG. 37 and the microelectronicdevice structure 3802 of FIG. 38, the microelectronic device structure3902 of FIG. 39 and/or the microelectronic device structure 4002 of FIG.40 may include multiple decks, each including an array of pillars 108,wherein the pillars 108 are substantially evenly spaced across therespective array, but wherein a pillar density of the pillars 108 of thelower deck 112 is less than a pillar density of the pillars 108 of theupper deck 110, which is less than a feature density of the conductivecontacts 2904, at least with respect to the lower elevations of thepillars 108 and the conductive contacts 2904.

With reference to FIG. 41, a microelectronic device structure 4102 maybe formed to include an array of the conductive contacts 2904 patternedwith an arrangement substantially matching that of the upper surfaces ofthe pillars 108 of the upper deck 110 of, e.g., the microelectronicdevice structure 2402 of FIG. 24C, such that the conductive contacts2904 may be arranged (e.g., laterally spaced) with a progressing pillardensity that decreases with increasing lateral distance from line 124.Accordingly, conductive contacts 2904 proximal to the line 124 may bespaced a distance 4104 that is less than the distance 904 at whichconnecting pillars 108 in the upper deck 110 (e.g., “connecting” meaningin physical contact with) are spaced, which may be less than thedistance 502 at which connecting pillars 108 in the lower deck 112 arespaced. Also accordingly, conductive contacts 2904 distal from the line124 may be spaced a distance 4106 that is greater than the distance 906at which connecting pillars 108 in the upper deck 110 are spaced, whichmay be greater than the distance 502 at which connecting pillars 108 inthe lower deck 112 are spaced. Alternatively, with reference to FIG. 42,a microelectronic device structure 4202 may be formed to include anarray of the conductive contacts 2904 patterned with an arrangementsubstantially matching that of the upper surfaces of the pillars 108 ofthe upper deck 110 of, e.g., the microelectronic device structure 2502of FIG. 25C, such that the conductive contacts 2904 may be arranged(e.g., laterally spaced) with a progressing pillar density thatdecreases with increasing lateral distance from line 124. Accordingly,conductive contacts 2904 proximal to the line 124 may be spaced adistance 4204 that is less than the distance 502 at which connectingpillars 108 in the upper deck 110 are spaced, which may be less than thedistance 1006 at which connecting pillars 108 of the lower deck 112 arespaced. Also accordingly, conductive contacts 2904 distal from the line124 may be spaced a distance 4206 that is greater than the distance 502at which connecting pillars 108 in the upper deck 110 are spaced, whichmay be greater than the distance 1004 at which connecting pillars 108 inthe lower deck 112 are spaced. Therefore, the microelectronic devicestructure 4102 of FIG. 41 and/or the microelectronic device structure4202 of FIG. 42 may include multiple decks, each including an array ofpillars 108, wherein the pillars 108 are substantially evenly spacedacross a respective array of at least one of the decks (e.g., the lowerdeck 112 of FIG. 41, the upper deck 110 of FIG. 42), but wherein thepillars 108 of at least one other of the decks (e.g., the upper deck 110of FIG. 41, the lower deck 112 of FIG. 42) have progressed spacing withvarying pillar density across the respective pillar array (e.g., withdecreasing pillar density with increased lateral distance from line 124,in the upper deck 110 of FIG. 41; with increasing pillar density withincreased lateral distance from line 124, in the lower deck 112 of FIG.42), the conductive contacts 2904 array also having progressed spacingwith varying feature density (e.g., decreased feature density withincreased lateral distance from line 124, as with FIG. 41 and FIG. 42).

As additional examples, with reference to FIG. 43, a microelectronicdevice structure 4302 may be formed to include an array of theconductive contacts 2904 patterned with an arrangement substantiallymatching that of the upper surfaces of the pillars 108 of the upper deck110 of, e.g., the microelectronic device structure 2702 of FIG. 27C,such that the conductive contacts 2904 may be arranged (e.g., laterallyspaced) with a substantially consistent spacing of distance 4304.Because the pillars 108 of the upper deck 110 may be arranged withprogressed spacing, in some areas of the array of the conductivecontacts 2904, neighboring conductive contacts 2904 may be spaced closertogether than (e.g., by distance 4304) than a distance (e.g., thedistance 1506) at which neighboring connecting pillars 108 of the upperdeck 110 are spaced, which may be a greater distance than the spacing(e.g., distance 502) at which neighboring connecting pillars 108 of thelower deck 112 are spaced. In other areas of the array of the conductivecontacts 2904, neighboring conductive contacts 2904 may be spacedfurther apart from one another (e.g., by distance 4304) than a distance(e.g., the distance 1504) at which neighboring connecting pillars 108 ofthe upper deck 110 are spaced, which may be less than a distance (e.g.,distance 502) at which neighboring connecting pillars 108 of the lowerdeck 112 are spaced. Alternatively, with reference to FIG. 44, amicroelectronic device structure 4402 may be formed to include an arrayof the conductive contacts 2904 patterned with an arrangementsubstantially matching that of the upper surfaces of the pillars 108 ofthe upper deck 110 of, e.g., the microelectronic device structure 2802of FIG. 28C, such that the conductive contacts 2904 may be arranged(e.g., laterally spaced) with a progressing pillar density thatdecreases with increasing lateral distance from line 124. Accordingly,conductive contacts 2904 proximal to the line 124 may be spaced adistance 4404 that is less than the distance 502 at which connectingpillars 108 in the upper deck 110 are spaced, which may be greater thanthe distance 1604 at which connecting pillars 108 of the lower deck 112are spaced. Also accordingly, conductive contacts 2904 distal from theline 124 may be spaced a distance 4406 that is greater than the distance502 at which connecting pillars 108 in the upper deck 110 are spaced,which may be less than the distance 1606 at which connecting pillars 108in the lower deck 112 are spaced. Therefore, the microelectronic devicestructure 4302 of FIG. 43 and/or the microelectronic device structure4402 of FIG. 44 may include multiple decks, each including an array ofpillars 108, wherein the pillars 108 are substantially evenly spacedacross a respective array of at least one of the decks (e.g., the lowerdeck 112 of FIG. 43, the upper deck 110 of FIG. 44), but wherein thepillars 108 of at least one other of the decks (e.g., the upper deck 110of FIG. 43, the lower deck of FIG. 44) have progressed spacing withvarying pillar density across the respective pillar array (e.g., withincreasing pillar density with increased lateral distance from line 124,in the upper deck 110 of FIG. 43; with decreasing pillar density withincreased lateral distance from line 124, in the lower deck 112 of FIG.44). Correspondingly, the feature density of the array of the conductivecontacts 2904 has a feature density that differs in type (e.g.,substantially consistent feature density with substantially evenlyspaced conductive contacts 2904, or progressed feature density withprogressed or otherwise varying spacing of the conductive contacts 2904across the array thereof, at least with respect to lower elevations ofthe conductive contacts 2904) from that of the connecting pillar array.For example, in FIG. 43, the array of the conductive contacts 2904 has asubstantially consistent feature density with substantially even spacingat distance 4304, in contrast to the progressed pillar density andvarying spacing (e.g., including distances 1504 and 1506) of the pillars108 of the upper deck 110. As another example, in FIG. 44, the array ofconductive contacts 2904 has a progressed feature density withprogressed spacing (e.g., including distances 4404 and 4406), incontrast to the substantially consistent pillar density andsubstantially even spacing (e.g., at distance 502) of the pillars 108 ofthe upper deck 110.

Accordingly, disclosed is a microelectronic device comprising a lowerdeck and an upper deck. Each deck comprises a stack structure comprisinga vertically alternating sequence of insulative structures andconductive structures arranged in tiers. A lower array of pillarsextends through the stack structure of the lower deck. An upper array ofpillars extends through the stack structure of the upper deck. Thepillars of the lower array align with the pillars of the upper array,along an interface between the lower deck and the upper deck. At leastat elevations comprising bases of the pillars, a pillar density of thelower array differs from a pillar density of the upper array.

Moreover, disclosed is a method of forming a microelectronic device, themethod comprising forming a lower stack structure comprising avertically alternating sequence of insulative structures and otherstructures arranged in tiers. A lower deck reticle, having a firstpattern feature density, is used to form a lower array of pillars in thelower stack structure. An upper stack structure is formed over the lowerstack structure. The upper stack structure comprises an additionalvertically alternating sequence of additional insulative structures andadditional other structures arranged in additional tiers. An upper deckreticle, having a second pattern feature density differing from thefirst pattern feature density, is used to form an upper array of pillarsin the upper stack structure. The pillars of the upper array align withthe pillars of the lower array along an interface between the lowerstack structure and the upper stack structure.

According to embodiments of the disclosure, including embodimentsdescribed above, where pillar arrays are formed on either side of anon-pillar feature or to either side of the die 302 (FIG. 3)—such thatline 124 may represent either the non-pillar feature or a centerline ofthe die 302, respectively—pillar bending exhibited in the left portion120 may be substantially mirrored to pillar bending exhibited in theright portion 122. However, the disclosure is not so limited. In otherembodiments, pillars 108 on opposite sides of the non-pillar feature(e.g., represented by line 124) may exhibit pillar pending in the samedirection as one another. Accordingly, any illustrated left side portion120 herein may be combined—in one or more embodiments—with anyillustrated right side portion 122

While the figures illustrate, and the embodiments described abovediscuss, spacing of pattern features (e.g., circles of reticles),pillars 108, and/or other features (e.g., the conductive contacts 2904)along an X-axis direction, reticle patterns—and therefore pillar spacingand other feature (e.g., conductive contact) spacing—may also oralternatively be tailored along a different horizontal direction, suchas along a Y-axis direction, or both, to achieve the same resultsdescribed above. Accordingly, a tailored reticle may compress, expand,or otherwise define pattern feature spacing that varies—compared to aninitial reticle—in either or both of the X-axis direction and/or theY-axis direction, with such tailoring further reflected in forming thecorresponding deck of a microelectronic device structure.

Accordingly, disclosed is a microelectronic device comprising a lowerdeck and an upper deck overlying the lower deck. The lower deckcomprises a first array of pillars comprising memory cells. The upperdeck comprises a second array of pillars comprising additional memorycells. At least some of the pillars of the first array of pillarsexhibit bending adjacent an interface between the lower deck and theupper deck. Along the interface, pillars of the second array of pillarsalign with pillars of the first array of pillars.

With reference to FIG. 45, illustrated is a partial cutaway,perspective, schematic illustration of a portion of a microelectronicdevice 4500 (e.g., a memory device, such as a dual deck 3D NAND Flashmemory device) including a microelectronic device structure 4502. Themicroelectronic device structure 4502 may be substantially similar toany of the above-described multi-deck microelectronic device structureswith aligned pillars of pillar arrays having different pillar densities(e.g., the microelectronic device structure 606 (FIG. 6C), 706 (FIG.7C), 908 (FIG. 9C), 1008 (FIG. 10C), 1206 (FIG. 12C), 1306 (FIG. 13C),1508 (FIG. 15C), 1608 (FIG. 16C), 1802 (FIG. 18C), 1902 (FIG. 19C), 2102(FIG. 21C), 2202 (FIG. 22C), 2402 (FIG. 24C), 2502 (FIG. 25C), 2702(FIG. 27C), 2802 (FIG. 28C), 2902 (FIG. 29), 3002 (FIG. 30), 3102 (FIG.31), 3202 (FIG. 32), 3302 (FIG. 33), 3402 (FIG. 34), 3502 (FIG. 35),3602 (FIG. 36), 3702 (FIG. 37), 3802 (FIG. 38), 3902 (FIG. 39), 4002(FIG. 40), 4102 (FIG. 41), 4202 (FIG. 42), 4302 (FIG. 43), 4402 (FIG.44)) (hereinafter collectively referred to as “any of the disclosedmicroelectronic device structures with aligned multi-deck pillar arraysof differing pillar densities”), which may have been formed with atleast one reticle defining a pattern tailored according to apreviously-observed pillar misalignment.

As illustrated in FIG. 45, the microelectronic device structure 4502 mayinclude a staircase structure 4526 (e.g., staircase structure 404 ofFIG. 4) defining contact regions for connecting access lines 4512 toconductive tiers 4510 (e.g., conductive layers, conductive plates, suchas the conductive structures 208 of FIG. 2A through FIG. 2E). Themicroelectronic device structure 4502 may include pillars 108 (e.g.,FIG. 29) with vertical strings 4514 (e.g., strings of memory cells 4506(e.g., one or more of memory cell 202 (FIG. 2A), memory cell 202′ (FIG.2B), memory cell 202″ (FIG. 2C), memory cell 202′″ (FIG. 2D), and/ormemory cell 202″″ (FIG. 2E)) that are coupled to each other in series.The pillars 108 with the vertical strings 4514 may extend at leastsomewhat vertically (e.g., in the Z-direction) and orthogonally relativeto conductive tiers 4510, relative to data lines 4504, relative to asource tier 4508 (e.g., within the base structure(s) 116 (e.g., FIG.29)), relative to access lines 4512, relative to first select gates 4516(e.g., upper select gates, drain select gates (SGDs)), relative toselect lines 4518, and/or relative to a second select gate 4520 (e.g., alower select gate, a source select gate (SGS)). However, one or more ofthe pillars 108 (e.g., FIG. 29) with the vertical strings 4514 mayexhibit bending in upper elevations. The first select gates 4516 may behorizontally divided (e.g., in the Y-direction) into multiple blocks4530 horizontally separated (e.g., in the Y-direction) from one anotherby slits 4528.

Vertical conductive contacts 4522 may electrically couple components toeach other, as illustrated. For example, the select lines 4518 may beelectrically coupled to the first select gates 4516, and the accesslines 4512 may be electrically coupled to the conductive tiers 4510. Themicroelectronic device 4500 may also include a control unit 4524positioned under the memory array, which may include at least one ofstring driver circuitry, pass gates, circuitry for selecting gates,circuitry for selecting conductive lines (e.g., the data lines 4504, theaccess lines 4512), circuitry for amplifying signals, and circuitry forsensing signals. The control unit 4524 may be electrically coupled tothe data lines 4504, the source tier 4508, the access lines 4512, thefirst select gates 4516, and/or the second select gates 4520, forexample. In some embodiments, the control unit 4524 includes CMOS(complementary metal-oxide-semiconductor) circuitry. In suchembodiments, the control unit 4524 may be characterized as having a“CMOS under Array” (“CuA”) configuration.

The first select gates 4516 may extend horizontally in a first direction(e.g., the X-direction) and may be coupled to respective first groups ofvertical strings 4514 of memory cells 4506 at a first end (e.g., anupper end) of the vertical strings 4514. The second select gate 4520 maybe formed in a substantially planar configuration and may be coupled tothe vertical strings 4514 at a second, opposite end (e.g., a lower end)of the vertical strings 4514 of memory cells 4506.

The data lines 4504 (e.g., bit lines) may extend horizontally in asecond direction (e.g., in the Y-direction) that is at an angle (e.g.,perpendicular) to the first direction in which the first select gates4516 extend. The data lines 4504 may be coupled to respective secondgroups of the vertical strings 4514 at the first end (e.g., the upperend) of the vertical strings 4514. A first group of vertical strings4514 coupled to a respective first select gate 4516 may share aparticular vertical string 4514 with a second group of vertical strings4514 coupled to a respective data line 4504. Thus, a particular verticalstring 4514 may be selected at an intersection of a particular firstselect gate 4516 and a particular data line 4504. Accordingly, the firstselect gates 4516 may be used for selecting memory cells 4506 of thevertical strings 4514 of memory cells 4506.

The conductive tiers 4510 (e.g., word line plates) may extend inrespective horizontal planes. The conductive tiers 4510 may be stackedvertically, such that each conductive tier 4510 is coupled to all of thevertical strings 4514 of memory cells 4506, and the vertical strings4514 of the memory cells 4506 extend vertically—with one or more of thevertical strings 4514 possibly exhibiting some pillar bending—throughthe stack (e.g., stack structure 114 (e.g., FIG. 29)) of conductivetiers 4510. The conductive tiers 4510 may be coupled to or may formcontrol gates of the memory cells 4506 to which the conductive tiers4510 are coupled. Each conductive tier 4510 may be coupled to one memorycell 4506 of a particular vertical string 4514 of memory cells 4506.

The first select gates 4516 and the second select gates 4520 may operateto select a particular vertical string 4514 of the memory cells 4506between a particular data line 4504 and the source tier 4508. Thus, aparticular memory cell 4506 may be selected and electrically coupled toa data line 4504 by operation of (e.g., by selecting) the appropriatefirst select gate 4516, second select gate 4520, and conductive tier4510 that are coupled to the particular memory cell 4506.

The staircase structure 4526 may be configured to provide electricalconnection between the access lines 4512 and the conductive tiers 4510through the vertical conductive contacts 4522. In other words, aparticular level of the conductive tiers 4510 may be selected via one ofthe access lines 4512 that is in electrical communication with arespective one of the vertical conductive contacts 4522 in electricalcommunication with the particular conductive tier 4510.

The data lines 4504 may be electrically coupled to the vertical strings4514 through conductive structures 4532 (e.g., the conductive contacts2904 (e.g., FIG. 29)).

Microelectronic devices (e.g., the microelectronic device 4500)including microelectronic device structures—such as any of the disclosedmicroelectronic device structures with aligned multi-deck pillar arraysof differing pillar densities—may be used in embodiments of electronicsystems of the disclosure. For example, FIG. 46 is a block diagram of anelectronic system 4600, in accordance with embodiments of thedisclosure. The electronic system 4600 may comprise, for example, acomputer or computer hardware component, a server or other networkinghardware component, a cellular telephone, a digital camera, a personaldigital assistant (PDA), a portable media (e.g., music) player, a Wi-Fior cellular-enabled tablet (e.g., an iPAD® or SURFACE® tablet, anelectronic book, a navigation device), etc. The electronic system 4600includes at least one memory device 4602. The memory device 4602 mayinclude, for example, one or more embodiment of a microelectronic deviceand/or structure previously described herein—such as any of thedisclosed microelectronic device structures with aligned multi-deckpillar arrays of differing pillar densities—with structures formedaccording to embodiments previously described herein.

The electronic system 4600 may further include at least one electronicsignal processor device 4604 (often referred to as a “microprocessor”).The processor device 4604 may, optionally, include an embodiment of amicroelectronic device and/or a microelectronic device structurepreviously described herein, such as any of the disclosedmicroelectronic device structures with aligned multi-deck pillar arraysof differing pillar densities, or such as the microelectronic device4500 of FIG. 45. The electronic system 4600 may further include one ormore input devices 4606 for inputting information into the electronicsystem 4600 by a user, such as, for example, a mouse or other pointingdevice, a keyboard, a touchpad, a button, or a control panel. Theelectronic system 4600 may further include one or more output devices4608 for outputting information (e.g., visual or audio output) to a usersuch as, for example, a monitor, a display, a printer, an audio outputjack, a speaker, etc. In some embodiments, the input device 4606 and theoutput device 4608 may comprise a single touchscreen device that can beused both to input information into the electronic system 4600 and tooutput visual information to a user. The input device 4606 and theoutput device 4608 may communicate electrically with one or more of thememory device 4602 and the electronic signal processor device 4604.

With reference to FIG. 47, shown is a block diagram of a processor-basedsystem 4700. The processor-based system 4700 may include variousmicroelectronic devices (e.g., the microelectronic device 4500 of FIG.45) and microelectronic device structures (e.g., any of the disclosedmicroelectronic device structures with aligned multi-deck pillar arraysof differing pillar densities) manufactured in accordance withembodiments of the present disclosure. The processor-based system 4700may be any of a variety of types, such as a computer, a pager, acellular phone, a personal organizer, a control circuit, or anotherelectronic device. The processor-based system 4700 may include one ormore processors 4702, such as a microprocessor, to control theprocessing of system functions and requests in the processor-basedsystem 4700. The processor 4702 and other subcomponents of theprocessor-based system 4700 may include microelectronic devices (e.g.,the microelectronic device 4500 of FIG. 45) and microelectronic devicestructures (e.g., any of the disclosed microelectronic device structureswith aligned multi-deck pillar arrays of differing pillar densities)manufactured in accordance with embodiments of the present disclosure.

The processor-based system 4700 may include a power supply 4704 inoperable communication with the processor 4702. For example, if theprocessor-based system 4700 is a portable system, the power supply 4704may include one or more of a fuel cell, a power scavenging device,permanent batteries, replaceable batteries, and/or rechargeablebatteries. The power supply 4704 may also include an AC adapter;therefore, the processor-based system 4700 may be plugged into a walloutlet, for example. The power supply 4704 may also include a DC adaptersuch that the processor-based system 4700 may be plugged into a vehiclecigarette lighter or a vehicle power port, for example.

Various other devices may be coupled to the processor 4702 depending onthe functions that the processor-based system 4700 performs. Forexample, a user interface 4714 may be coupled to the processor 4702. Theuser interface 4714 may include one or more input devices, such asbuttons, switches, a keyboard, a light pen, a mouse, a digitizer andstylus, a touch screen, a voice recognition system, a microphone, or acombination thereof. A display 4706 may also be coupled to the processor4702. The display 4706 may include an LCD display, an SED display, a CRTdisplay, a DLP display, a plasma display, an OLED display, an LEDdisplay, a three-dimensional projection, an audio display, or acombination thereof. Furthermore, an RF subsystem/baseband processor4708 may also be coupled to the processor 4702. The RFsubsystem/baseband processor 4708 may include an antenna that is coupledto an RF receiver and to an RF transmitter. A communication port 4710,or more than one communication port 4710, may also be coupled to theprocessor 4702. The communication port 4710 may be adapted to be coupledto one or more peripheral devices 4712 (e.g., a modem, a printer, acomputer, a scanner, a camera) and/or to a network (e.g., a local areanetwork (LAN), a remote area network, an intranet, or the Internet).

The processor 4702 may control the processor-based system 4700 byimplementing software programs stored in the memory (e.g., system memory4716). The software programs may include an operating system, databasesoftware, drafting software, word processing software, media editingsoftware, and/or media-playing software, for example. The memory (e.g.,the system memory 4716) is operably coupled to the processor 4702 tostore and facilitate execution of various programs. For example, theprocessor 4702 may be coupled to system memory 4716, which may includeone or more of spin torque transfer magnetic random access memory(STT-MRAM), magnetic random access memory (MRAM), dynamic random accessmemory (DRAM), static random access memory (SRAM), racetrack memory,and/or other known memory types. The system memory 4716 may includevolatile memory, nonvolatile memory, or a combination thereof. Thesystem memory 4716 is typically large so it can store dynamically loadedapplications and data. In some embodiments, the system memory 4716 mayinclude semiconductor devices (e.g., the microelectronic device 4500 ofFIG. 45) and structures (e.g., any of the disclosed microelectronicdevice structures with aligned multi-deck pillar arrays of differingpillar densities) described above, or a combination thereof

The processor 4702 may also be coupled to nonvolatile memory 4718, whichis not to suggest that system memory 4716 is necessarily volatile. Thenonvolatile memory 4718 may include one or more of STT-MRAM, MRAM,read-only memory (ROM) (e.g., EPROM, resistive read-only memory (RROM)),and Flash memory to be used in conjunction with the system memory 4716.The size of the nonvolatile memory 4718 is typically selected to be justlarge enough to store any necessary operating system, applicationprograms, and fixed data. Additionally, the nonvolatile memory 4718 mayinclude a high-capacity memory (e.g., disk drive memory, such as ahybrid-drive including resistive memory or other types of nonvolatilesolid-state memory, for example). The nonvolatile memory 4718 mayinclude microelectronic devices (e.g., the microelectronic device 4500of FIG. 45) and structures (e.g., any of the disclosed microelectronicdevice structures with aligned multi-deck pillar arrays of differingpillar densities) described above, or a combination thereof

Accordingly, disclosed is an electronic system comprising an inputdevice, an output device, a processor device, and a memory device. Theprocessor device is operably coupled to the input device and to theoutput device. The memory device is operably coupled to the processordevice. The memory device comprises at least one microelectronic devicestructure. The at least one microelectronic device structure comprisesat least two decks, each of the decks comprising pillars extendingthrough a stack structure of vertically alternating insulativestructures and conductive structures arranged in tiers. The at least twodecks include an upper deck and a lower deck. The pillars of the upperdeck define a first pillar density across an array of the pillars of theupper deck. The pillars of the lower deck define a second pillardensity, different than the first pillar density, across an array of thepillars of the lower deck. The pillars of the lower deck are in physicalcontact with the pillars of the upper deck along an interface betweenthe lower deck and the upper deck.

While the disclosed structures, apparatus (e.g., devices), systems, andmethods are susceptible to various modifications and alternative formsin implementation thereof, specific embodiments have been shown by wayof example in the drawings and have been described in detail herein.However, the disclosure is not intended to be limited to the particularforms disclosed. Rather, the disclosure encompasses all modifications,combinations, equivalents, variations, and alternatives falling withinthe scope of the disclosure as defined by the following appended claimsand their legal equivalents.

What is claimed is:
 1. A microelectronic device, comprising: a lowerdeck and an upper deck, each comprising a stack structure comprising avertically alternating sequence of insulative structures and conductivestructures arranged in tiers; a lower array of pillars extending throughthe stack structure of the lower deck; and an upper array of pillarsextending through the stack structure of the upper deck, the pillars ofthe lower array aligning with the pillars of the upper array along aninterface between the lower deck and the upper deck, and at least atelevations comprising bases of the pillars, a pillar density of thelower array differing from a pillar density of the upper array.
 2. Themicroelectronic device of claim 1, wherein: the pillar density of thelower array is substantially consistent across the lower array; thepillar density of the upper array is substantially consistent across theupper array; and the pillar density of the lower array is less than thepillar density of the upper array.
 3. The microelectronic device ofclaim 1, wherein: the pillar density of the lower array is substantiallyconsistent across the lower array; and in at least one portion of theupper array, the pillar density of the upper array progressivelyincreases with increased lateral distance from an edge of the upperarray.
 4. The microelectronic device of claim 1, wherein: the pillardensity of the lower array is substantially consistent across the lowerarray; and in at least one portion of the upper array, the pillardensity of the upper array progressively decreases with increasedlateral distance from an edge of the upper array.
 5. The microelectronicdevice of claim 1, wherein: in at least one portion of the lower array,the pillar density of the lower array progressively increases withincreased lateral distance from an edge of the lower array; and thepillar density of the upper array is substantially consistent across theupper array.
 6. The microelectronic device of claim 1, wherein: in atleast one portion of the lower array, the pillar density of the lowerarray progressively decreases with increased lateral distance from anedge of the lower array; and the pillar density of the upper array issubstantially consistent across the upper array.
 7. The microelectronicdevice of claim 1, wherein: the pillar density of the lower array issubstantially consistent across the lower array; in at least one portionof the upper array, neighboring pillars of the upper array are moreclosely spaced than are neighboring pillars of the lower array withwhich the neighboring pillars of the upper array are in physical contactat the interface; and in at least one other portion of the upper array,other neighboring pillars of the upper array are further spaced than areother neighboring pillars of the lower array with which the otherneighboring pillars of the upper array are in physical contact at theinterface.
 8. The microelectronic device of claim 1, wherein: the pillardensity of the upper array is substantially consistent across the upperarray; in at least one portion of the lower array, neighboring pillarsof the lower array are more closely spaced than are neighboring pillarsof the upper array with which the neighboring pillars of the lower arrayare in physical contact at the interface; and in at least one otherportion of the lower array, other neighboring pillars of the lower arrayare further spaced than are other neighboring pillars of the upper arraywith which the other neighboring pillars of the lower array are inphysical contact at the interface.
 9. The microelectronic device ofclaim 1, wherein at least some of the pillars of the lower array exhibitpillar bending adjacent the interface, the at least some of the pillarsexhibiting the pillar bending being pillars of the lower array aligningwith the pillars of the upper array along the interface.
 10. Themicroelectronic device of claim 9, wherein at least some of the pillarsof the upper array also exhibit pillar bending in upper elevations ofthe pillars of the upper array.
 11. The microelectronic device of claim1, further comprising an array of conductive contacts on the upper deck,the conductive contacts aligning with the pillars of the upper array.12. The microelectronic device of claim 11, wherein the array ofconductive contacts exhibits a feature density substantially consistentacross the array of conductive contacts.
 13. The microelectronic deviceof claim 11, wherein the array of conductive contacts exhibits a varyingfeature density across the array of conductive contacts.
 14. Themicroelectronic device of claim 1, further comprising a staircase regionformed in the stack structure of the lower deck and the upper deck, thestaircase region being laterally adjacent the upper array of pillars andthe lower array of pillars.
 15. A method for forming a microelectronicdevice, comprising: forming a lower stack structure comprising avertically alternating sequence of insulative structures and otherstructures arranged in tiers; using a lower deck reticle having a firstpattern feature density, forming a lower array of pillars in the lowerstack structure; forming an upper stack structure over the lower stackstructure, the upper stack structure comprising an additional verticallyalternating sequence of additional insulative structures and additionalother structures arranged in additional tiers; and using an upper deckreticle having a second pattern feature density differing from the firstpattern feature density, forming an upper array of pillars in the upperstack structure, the pillars of the upper array aligning with thepillars of the lower array along an interface between the lower stackstructure and the upper stack structure.
 16. The method of claim 15,further comprising, before forming the lower stack structure and formingthe upper stack structure of the microelectronic device, forming aninitial microelectronic device structure comprising: using an initialreticle having an initial pattern feature density, forming an initialarray of other pillars in an initial stack structure, at least some ofthe other pillars exhibiting pillar bending, the initial pattern featuredensity, wherein the second pattern feature density is greater than theinitial pattern feature density.
 17. The method of claim 15, furthercomprising, before forming the lower stack structure and forming theupper stack structure of the microelectronic device, forming an initialmicroelectronic device structure comprising: using an initial reticlehaving an initial pattern feature density, forming an initial array ofother pillars in an initial stack structure, at least some of the otherpillars exhibiting pillar bending, the initial pattern feature density,wherein the first pattern feature density is less than the initialpattern feature density.
 18. The method of claim 15, further comprisingselecting one or more of the first pattern feature density and thesecond pattern feature density to have a not-consistently spacedarrangement of pattern features.
 19. The method of claim 15, furthercomprising replacing, with at least one conductive material, at least aportion of a sacrificial material of one or more of the other structuresand the additional other structures.
 20. A microelectronic device,comprising: a lower deck comprising a first array of pillars comprisingmemory cells; and an upper deck overlying the lower deck and comprisinga second array of pillars comprising additional memory cells, at leastsome pillars of the first array of pillars exhibiting bending adjacentan interface between the lower deck and the upper deck, and along theinterface, pillars of the second array of pillars aligning with pillarsof the first array of pillars.
 21. The microelectronic device of claim20, wherein at least some of the pillars of the second array alsoexhibit bending adjacent an upper boundary of the second array ofpillars.
 22. The microelectronic device of claim 20, wherein neighboringpillars, of the first array of pillars, are laterally spaced from oneanother, along the interface, by a different distance than a distancelaterally spacing neighboring pillars of the second array of pillars.23. The microelectronic device of claim 20, wherein at least someneighboring pillars, of one or more of the first array of pillars andthe second array of pillars, are laterally spaced from one another,along the interface, by a different distance than a distance laterallyspacing additional neighboring pillars of the one or more of the firstarray of pillars and the second array of pillars.
 24. An electronicsystem, comprising: an input device; an output device; a processordevice operably coupled to the input device and to the output device;and a memory device operably coupled to the processor device andcomprising at least one microelectronic device structure, the at leastone microelectronic device structure comprising at least two decks eachcomprising pillars extending through a stack structure of verticallyalternating insulative structures and conductive structures arranged intiers, the pillars of an upper deck, of the at least two decks, defininga first pillar density across an array of the pillars of the upper deck,the pillars of a lower deck, of the at least two decks, defining asecond pillar density, different than the first pillar density, acrossan array of the pillars of the lower deck, and the pillars of the lowerdeck being in physical contact with the pillars of the upper deck alongan interface between the lower deck and the upper deck.
 25. Theelectronic system of claim 24, wherein, in at least a portion of thearray of the pillars of the lower deck, the pillars exhibitprogressively greater amounts of pillar bending with increased lateraldistance along the portion.